Semiconductor Light Emitting Module Heat Dissipation Design
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Solution Overview
Problem
Conventional semiconductor light emitting modules face issues with heat dissipation as brightness increases, leading to excessive heating of the LED chip and potential changes in the quality of the sealing resin.
Innovation Solution
The semiconductor light emitting module design includes a lead with an extension and a mounting terminal that extends perpendicularly to efficiently dissipate heat by bonding to a circuit board, along with a zener diode for protecting against reverse voltage, and a case with a space that accommodates the LED chip and zener diode, using a plating layer with higher solder wettability for secure mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the brightness of the semiconductor light emitting module is increased, then the light output is improved, but the heat generated at the LED chip increases causing excessive heating
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional lead structure by adding a dedicated heat dissipation member that extends from the lead frame into the case. This separate heat dissipation path removes thermal energy from the LED chip without interfering with the electrical connection function of the leads, allowing high brightness operation without excessive heating.
Solution Approach 2:
The heat dissipation member acts as an intermediary between the LED chip and the external environment. It provides a thermal conduction path that mediates the heat transfer from the high-brightness LED chip to the case and ultimately to the surrounding air, preventing direct heat accumulation at the chip while maintaining light output.
2Illumination intensity
If the brightness is increased to improve performance, then the light output is enhanced, but the quality of the sealing resin changes due to excessive heat
Solution Approach 1:
The patent extracts the heat away from the sealing resin by introducing a dedicated heat dissipation member that creates a separate thermal pathway. This removes the harmful thermal effect from the resin environment while preserving the high brightness light output, preventing degradation of the sealing resin quality.
Solution Approach 2:
The patent converts the harmful heat generated by high-brightness LEDs into a beneficial effect by channeling it through the heat dissipation member. The heat that would otherwise degrade the sealing resin is instead directed to the heat dissipation member and case, where it can be safely dissipated, turning a harmful thermal byproduct into a controlled thermal management solution.
3Volume of moving object
If a compact design is used to reduce module size, then the dimensions are reduced, but the heat dissipation capability is insufficient
Solution Approach 1:
The patent utilizes the vertical dimension (height) of the module by extending the heat dissipation member upward from the lead frame into the case space. This three-dimensional approach allows effective heat dissipation without increasing the footprint area, maintaining compact module dimensions while providing sufficient thermal management capability through vertical heat conduction paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for increased brightness by effective heat dissipation and prevents damage from reverse voltage, ensuring stable operation and compact dimensions.
Implementation Method 1
The first lead is provided with an extension extending from the first die bonding pad and with a mounting terminal connected to the extension, where the extension extends in a second direction perpendicular to the first direction and contained in the plane of the first die bonding pad. The mounting terminal extends perpendicularly to the second direction.
Implementation Method 2
a plating layer covering an end surface of the mounting terminal and having a higher solder wettability than the mounting terminal
Implementation Method 3
the first lead may include a second die bonding pad extending from the first die bonding pad in the first direction toward the second lead and located at a position deviated toward an end of the space in the second direction, where the zener diode is attached to the second die bonding pad
Data Source
AI summary
A light emitting module includes a semiconductor light source, a first lead with a bonding pad to which the light source is attached, and a second lead spaced from the first lead in a first direction contained in the plane of the first die bonding pad. The second lead includes a wire bonding pad connected to the light source via a wire. The module also includes a case formed with a space elongated in the first direction for accommodating the light source. The first lead includes an extension extending from the first die bonding pad, and a mounting terminal connected to the extension. The extension extends in a second direction that is perpendicular to the first direction and contained in the plane of the first die bonding pad. The mounting terminal extends perpendicularly to the second direction. The extension overlaps the light source in the first direction.