LED Module Thermal Management via Integrated Heat Sink
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Solution Overview
Problem
Conventional LED modules face inefficiencies in heat dissipation, leading to luminous decay and reduced flexibility due to thick metal substrates and degradation of insulative packaging, which limits their application and lifespan.
Innovation Solution
A light emitting diode module design featuring a printed circuit board with a metallic heat sink and thermal connection layer, where LED chips are directly attached to chip-support portions on the heat sink, allowing for efficient heat dissipation and a thinner, more flexible structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal seat is added to conduct heat from the LED chip to the back plate, then heat dissipation efficiency is improved, but the total thickness of the LED module increases
Solution Approach 1:
The invention merges the metal seat function with the back plate by extending the back plate to form a protrusion that directly contacts the LED chip. This integration eliminates the need for a separate metal seat component while maintaining the heat conduction path from the LED chip through the back plate to the heat dissipation structure.
Solution Approach 2:
The back plate is designed to serve multiple functions simultaneously: it acts as a structural support, provides a heat conduction path through its protrusion, and forms part of the heat dissipation structure. This multi-functionality reduces the number of separate components needed and decreases overall module thickness.
2Reliability
If an insulative packaging member surrounds the metal seat to provide electrical insulation, then electrical connection protection is improved, but the packaging member degrades or discolors over time causing luminous decay and reducing module lifetime
Solution Approach 1:
The invention removes the insulative packaging member that surrounds the metal seat by redesigning the structure to eliminate the need for this separate insulation component. The electrical insulation function is achieved through the circuit board's own structure and the integrated back plate design, eliminating the degradable packaging material entirely.
Solution Approach 2:
The invention replaces the degradable insulative packaging member with more stable structural components. The circuit board and back plate provide long-term structural and electrical insulation without the degradation issues associated with organic packaging materials.
3Length of stationary object
If the thickness of the metal substrate is reduced to improve flexibility, then flexibility and thinness are improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The invention applies local quality by creating a protrusion of the back plate that extends toward the LED chip. This localized structural feature concentrates the heat conduction path in a specific area, improving heat dissipation efficiency without requiring the entire back plate to be thick. The protrusion provides adequate thermal contact while keeping the overall module thin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation efficiency, reduces module thickness, and increases flexibility, thereby extending the lifespan and application scope of LED modules while preventing luminous decay from material degradation.
Implementation Method 1
a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board
Data Source
AI summary
A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.