LED Module Lead Protection via Inclined Protective Portion
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Solution Overview
Problem
Conventional LED modules experience a reduction in lifespan due to color changes in silver-plated leads, which affect light characteristics, and protective coverings can cause wire breakage during assembly.
Innovation Solution
The LED module design includes leads with die-bonding and wire-bonding portions, a support member with a protective portion that has an inclined surface to cover the leads without obstructing wire connections, and a reflective surface to maintain light emission direction, preventing color changes and wire breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protective portions are provided to cover the leads, then the color change of leads is prevented, but the wires may be broken due to contact with the protective portions
Solution Approach 1:
The protective portion is designed with different thicknesses at different locations: a first thickness in the die-bonding region and a smaller second thickness in the wire-bonding region. This local variation in geometry allows the protective portion to cover the leads for color change prevention while creating sufficient clearance in the wire-bonding area to prevent wire breakage during assembly.
2Reliability
If the leads are plated with silver, then the heat conductivity and electric conductivity are enhanced, but the surfaces change to dark color as time elapses
Solution Approach 1:
The protective portion is positioned to cover the silver-plated surfaces of the leads before they are exposed to environmental factors that cause oxidation and color change. By providing this protective coverage from the outset, the invention prevents the harmful oxidation process, thereby maintaining the original appearance and conductivity of the silver-plated leads throughout the product's service life.
3Reliability
If the protective portion covers the leads extensively, then color change is prevented, but light emission characteristics are reduced
Solution Approach 1:
The protective portion is designed with spatially varying thickness: a first thickness in the die-bonding region providing adequate coverage, and a smaller second thickness in the light emission region. This local differentiation ensures sufficient protection against color change in the lead areas while maintaining light transmission characteristics in the regions critical for light emission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design extends the LED module's lifespan by minimizing the impact of color changes on light characteristics and reducing wire breakage, while maintaining reliability and increasing light emission.
Implementation Method 1
the support member 94 has a reflective surface 94a that reflects light traveling sideways from the LED chip 93 in the figure upward
Implementation Method 2
The LED chip 93 is bonded to the lead 91 with a bonding material, not shown
Data Source
AI summary
An LED module A1 is provided with: a first lead 1 including a die-bonding portion 12 with a mount surface 12a, and a front-end sunk portion 14; a second lead 2 including a wire-bonding portion 22 and spaced apart from the first lead 1; an LED chip 3 mounted on the mount surface 12a and provided with a first electrode terminal 31 and a second electrode terminal 32; a wire 61 connecting the second electrode terminal 32 and the wire-bonding portion 22; and a support member 4 including a protective portion 42 and supporting the leads 1 and 2. The protective portion covers the front-end sunk portion 14 with the mount surface 12a exposed, and includes an inclined portion 42a that becomes thinner as proceeding from the die-bonding portion 12 toward the lead 2.