Light Emitting Device Module With Insulated Conductive Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Light emitting device modules face challenges in achieving optimal optical efficiency due to issues with heat transfer and conductive adhesive penetration, which can lead to brightness degradation and color variation.
Innovation Solution
A light emitting device module design featuring a heat transfer member with a cavity, first and second conductive layers separated by an insulating layer, and exposed portions to prevent conductive adhesive penetration, utilizing materials like copper or aluminum for heat transfer and polyimide for insulation, with specific patterns and shapes to enhance thermal and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating layer completely covers the heat transfer member, then electrical insulation is improved, but light absorption increases and optical efficiency deteriorates
Solution Approach 1:
The insulating layer is selectively positioned to cover only specific regions where electrical insulation is required, while leaving other regions exposed to maintain optical efficiency. This local differentiation resolves the contradiction by applying insulation only where necessary rather than uniformly across the entire heat transfer member.
Solution Approach 2:
The insulating layer is divided into multiple discrete regions rather than forming a continuous covering. This segmentation allows certain areas to provide electrical insulation while other areas remain exposed for optimal light transmission, thus resolving the conflict between insulation requirements and optical efficiency.
2Reliability
If conductive adhesive is used to connect circuit boards, then electrical connection is improved, but adhesive penetration into the cavity causes brightness degradation and color variation
Solution Approach 1:
The insulating layer serves as an intermediary barrier that prevents conductive adhesive from penetrating into the cavity while still allowing electrical connection to be established. This mediator blocks the harmful adhesive flow path without interfering with the intended electrical connection function.
Solution Approach 2:
The harmful penetration path of the conductive adhesive is extracted or blocked by the insulating layer, separating the adhesive application area from the cavity region. This prevents the adhesive from reaching areas where it would cause brightness degradation and color variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves optical efficiency by reducing light absorption in the insulating layer, maintaining brightness, and allowing for effective heat dissipation, thus enhancing the reliability and cost-effectiveness of the light emitting device modules.
Implementation Method 1
a heat transfer member having a cavity, first conductive layer and second conductive layer contacting the heat transfer member
Implementation Method 2
first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically separated from each other
Data Source
AI summary
Disclosed herein is a semiconductor light emitting device module comprising: a heat transfer member having a cavity; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically separated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member; and at least one semiconductor light emitting device electrically connected to the first conductive layer and the second conductive layer, the at least one semiconductor light emitting device is thermally contacted an exposed portion of the heat transfer member, wherein the insulating layer has an exposed portion disposed outside the cavity.