LED Light Source Module Structure for Insulation and Warpage Control
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Solution Overview
Problem
Existing light source modules with LEDs face challenges in enhancing optical characteristics and reliability, particularly in withstanding physical stress and maintaining insulation integrity.
Innovation Solution
A light source module design featuring a support structure with a substrate and insulating films that covers the wiring and substrate surfaces, along with a printed circuit board overlapping the light-emitting cells, to improve structural stability and insulation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a support substrate is introduced between the wiring structure and PCB, then insulation integrity is improved, but device complexity increases
Solution Approach 1:
A support substrate is introduced as an intermediary component between the wiring structure and the PCB. This support substrate provides enhanced insulation integrity and structural stability, preventing direct contact between conductive elements and the PCB, thereby resolving the insulation reliability issue while maintaining a manageable structural complexity through modular design.
Solution Approach 2:
The support substrate is configured with a composite structure including a substrate body and insulating films formed on its surfaces. This composite material approach combines the mechanical support function of the substrate with the electrical insulation function of the insulating films, achieving both structural stability and insulation integrity simultaneously.
2Reliability
If insulating films are added to cover substrate surfaces, then electrical insulation is improved, but manufacturing complexity increases
Solution Approach 1:
Insulating films are formed on the surfaces of the support substrate during the manufacturing process, before final assembly. This preliminary action ensures that the insulating protection is already in place, preventing potential electrical failures and simplifying the overall manufacturing workflow by integrating the insulation step into the substrate fabrication process.
3Illumination intensity
If the PCB overlaps the light-emitting cells, then optical characteristics are improved, but structural stability deteriorates due to warpage
Solution Approach 1:
The support substrate acts as a counterbalancing element that compensates for the warpage forces generated by the overlapping PCB configuration. By providing a rigid, stable platform, the support substrate counteracts the deformation tendencies, maintaining structural stability while allowing the PCB to overlap the light-emitting cells for optimized optical characteristics.
4Strength
If the support structure is designed to extend in lateral direction, then mechanical strength is improved, but device complexity increases
Solution Approach 1:
The support substrate is designed to extend in the lateral direction, serving multiple functions simultaneously: providing mechanical strength to prevent warpage, offering a mounting surface for the wiring structure, and ensuring structural alignment between components. This multi-functional design achieves enhanced mechanical strength without proportionally increasing device complexity.
Data Source
AI summary
A light source module includes a light-emitting cell, a wiring structure provided on the light-emitting cell and connected to the light-emitting cell, a support structure that is apart from the light-emitting cell with the wiring structure therebetween in a vertical direction, a printed circuit board (PCB) that is apart from the wiring structure with the support substrate therebetween in the vertical direction and overlapping the light-emitting cell in the vertical direction, and at least one insulating film that is apart from the wiring structure in the vertical direction and covering at least one of a first surface of the support substrate, which faces the wiring structure, and a second surface of the support substrate, which faces the PCB.