LED Module Integrated Current Regulator
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Solution Overview
Problem
The existing LED modules face challenges in miniaturization and integration due to the space constraints imposed by the need for current regulators, which complicates the design of compact LED luminaires and increases manufacturing costs.
Innovation Solution
An LED module with a multilayer board featuring a metal surface and dielectric layer, where the current regulator is integrated exclusively on the dielectric layer, allowing for precise tuning and matching with the LED chip, and operating with a constant voltage supply, thereby minimizing space requirements and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a current regulator is integrated into the LED module, then current control precision is improved, but the module dimensions increase
Solution Approach 1:
The patent transitions from planar PCB mounting to three-dimensional vertical stacking by placing the current regulator directly on the LED chip in a stacked configuration. This vertical integration allows current control functionality to be added without increasing the lateral footprint of the module, effectively resolving the contradiction between control precision and module dimensions.
Solution Approach 2:
The current regulator and LED chip are merged into a single integrated structure where the regulator is positioned directly on the chip. This consolidation eliminates the need for separate regulator components and interconnections, reducing overall module volume while maintaining precise current control capability.
2Adaptability or versatility
If AC/DC converter is directly arranged at the LED module, then integration is improved, but the required space increases
Solution Approach 1:
The patent employs vertical stacking to place the AC/DC converter in three-dimensional space above the LED chip rather than spreading it out laterally. This approach achieves high integration level while minimizing the lateral area occupied by the converter circuitry.
Solution Approach 2:
The converter components are nested in a stacked configuration where smaller components are positioned vertically above larger ones, similar to nested dolls. This nesting strategy maximizes space utilization and achieves integration without proportionally increasing the module's footprint area.
3Reliability
If external AC/DC converters are used for each LED module, then current control is improved, but manufacturing costs increase
Solution Approach 1:
The patent merges the AC/DC converter and LED chip into a single integrated module, eliminating the need for separate external converters. This consolidation reduces the total component count and simplifies assembly processes, thereby reducing manufacturing costs while maintaining reliable current control through the integrated design.
Solution Approach 2:
The integrated module design creates a universal component that combines power conversion and LED illumination functions in one unit. This multi-functionality allows for standardized manufacturing processes and reduced inventory complexity, leading to lower overall manufacturing costs compared to assembling separate specialized components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a compact and cost-effective LED module with improved performance by allowing for precise current regulation directly on the module, reducing the need for external AC/DC converters and enabling efficient light output tuning during manufacturing.
Implementation Method 1
the metal surface is a metal substrate, a metal layer or a metal foil and is a plated or coated aluminium substrate having a reflective surface
Data Source
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AI summary
The present application relates to a LED module (10) for being connected to a DC power supply (11), the LED module comprising a multilayer board (2) comprising a metal surface (2a) and a dielectric layer (2b) arranged thereon, at least one LED chip (1) arranged on the metal surface (2a) of the multilayer board, an encapsulation layer (3) arranged above the at least one LED chip (1), and current regulator means (4) arranged on the multilayer board, wherein the current regulator means (4) are designed to convert a DC input provided to the module (10) to a predefined DC output for being provided to the at least one LED chip (1).