Vehicle LED Module Interposer Layout for Heat and Wiring Constraints

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Solution Overview

Problem

Existing land vehicle light modules using monolithic arrays of LEDs face challenges with heat dissipation and geometric incompatibilities between the LED matrix and its driver, leading to degraded performance and increased size due to heat generation and non-standardized dimensions.

Innovation Solution

A land vehicle light module design incorporating an interposer that electrically connects the LED matrix to an electronic device, utilizing an interposer with a substrate that provides electrical insulation and heat dissipation, along with a heat sink to manage heat transfer, allowing for compact size and efficient control of high pixel density LEDs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the LED matrix is stacked with its driver circuit, then the wiring complexity is reduced, but heat dissipation is degraded and components may be destroyed by heat

Engineering Contradiction:
Improvewiring complexityVSAvoidheat dissipation
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent divides the system into two separate functional modules: an LED matrix module and a driver circuit module. This segmentation allows each module to be optimized independently - the LED matrix can be densely packed for high resolution while the driver circuit can be positioned separately for effective heat dissipation, thus resolving the contradiction between reduced wiring complexity and improved heat management

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediary connection mechanism (such as a flexible circuit board or wire harness) that bridges the LED matrix and driver circuit. This intermediary allows electrical connections to be established without direct stacking, enabling both modules to maintain optimal thermal conditions while still achieving manageable wiring complexity through structured interconnection

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If the driver is implemented on a standardized ASIC, then manufacturing is simplified, but geometric incompatibility with the LED matrix increases the overall module size

Engineering Contradiction:
Improvedriver manufacturingVSAvoidlight module size
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. The LED matrix and driver circuit are arranged on different layers/planes, connected through vertical interconnections. This dimensional change allows both components to maintain their standardized forms while achieving compact integration, resolving the geometric incompatibility issue without increasing overall module volume

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a nested arrangement where the driver circuit is positioned within or adjacent to the LED matrix structure. The driver can be housed in a recessed area or mounted on the reverse side of the LED matrix, allowing both standardized components to be integrated in a compact configuration that minimizes overall module size while maintaining manufacturing simplicity

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively addresses heat dissipation and geometric issues, enabling a compact, efficient, and easily mountable light module with improved heat management and reduced wiring complexity, maintaining high pixel density and control precision.

Implementation Method 1

an interposer (210) electrically connecting the light-emitting source (200) and the electronic device (220)... an interposer with a substrate that provides electrical insulation

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

heat dissipation is degraded by the very fact of stacking the LED matrix with its driver... the heat generated by the LEDs causes a rise in temperature... along with a heat sink to manage heat transfer

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Implementation Method 3

an interposer with a substrate that provides electrical insulation and heat dissipation

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3513120B1Cabling of a high resolution light source
Publication Date: 2025.09.03 VALEO VISION SA
  • EP3513120B1 patent drawingFigure 1~2
  • EP3513120B1 patent drawingFigure 3

AI summary

The invention relates in particular to a lighting module for a land vehicle, comprising a light-emitting source including at least one light-emitting element, an electronic device for controlling the light-emitting element, and an interposer providing an electrical connection between the light-emitting source and the electronic device.