LED Module Lens Curvature for Uniform White Light
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Solution Overview
Problem
Existing light emitting diode (LED) modules fail to produce uniform white light due to non-uniform mixing of light emitted by blue, red, and green LEDs, which affects the quality of the light output.
Innovation Solution
A light emitting diode module design incorporating a lead frame, light emitting diode chips, an encapsulant, and a lens structure with specific curved surfaces and reflective surfaces that mix light beams from multiple LEDs, allowing for uniform optical output by controlling the propagation direction and intensity of light beams through total internal reflection and wavelength conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple light emitting diodes with different wavelengths are mixed to generate specific wavelength light, then the light quality and uniformity are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple light emitting diodes (blue, red, green LEDs) with different wavelengths into a single module, using their light mixing to generate uniform white light. This merging approach improves light quality while managing device complexity through integrated design
Solution Approach 2:
The patent introduces an encapsulant as an intermediary medium that fills the space between multiple LEDs and facilitates light mixing. The encapsulant acts as a mediator that enables uniform light output by allowing optical interaction between different wavelength lights without requiring complex external mixing mechanisms
2Illumination intensity
If blue, red, and green light emitting diodes are mixed to obtain white light, then the desired wavelength is achieved, but the light uniformity deteriorates if the LEDs are not mixed uniformly
Solution Approach 1:
The patent positions different types of light emitting diodes at specific locations within the module, with each LED type placed in optimized positions relative to the encapsulant and lens structure. This local quality approach ensures uniform light mixing by controlling the spatial distribution of different wavelength sources
Solution Approach 2:
The patent employs a lens structure with curved surfaces that refract and redirect light from multiple LEDs. The curved geometry of the lens helps to uniformly mix light rays from different directions and wavelengths, achieving homogeneous white light output
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves uniform optical output by effectively mixing light from different LEDs, enhancing light quality and intensity through the use of curved surfaces and reflective surfaces, and optional wavelength conversion materials.
Implementation Method 1
The lens structure has a first light emitting curved surface, a second light emitting curved surface, a third light emitting curved surface, a fourth light emitting curved surface, a bottom surface, and at least one reflective surface
Implementation Method 2
The lens structure has a first light emitting curved surface, a second light emitting curved surface, a third light emitting curved surface, a fourth light emitting curved surface
Implementation Method 3
A light emitting diode (LED) is a kind of luminous semiconductor device. With the recombination of holes and electrons in semiconductor of a luminous layer in the LED, the luminous layer therein generates photons and emits light
Implementation Method 4
The encapsulant is filled in the accommodating recess and covers the first and the second light emitting diode chips
Data Source
AI summary
A light emitting diode module includes a lead frame, a first light emitting diode chip, a second light emitting diode chip, an encapsulant, and a lens structure. The lead frame has a die-bonding surface and a side wall together defining an accommodating recess. The encapsulant is filled in the accommodating recess, and covers the first and the second light emitting diode chips. The lens structure disposed on the lead frame has a bottom surface, a reflective surface, a first, a second, a third, and a fourth light emitting curved surface. The light emitting curved surfaces are respectively disposed opposite to the bottom surface. An adjacent position among the light emitting curved surfaces is a lowest point nearest to the bottom surface. The first and the second light emitting diode chips are disposed at the projections of the first and the second light emitting curved surface on the die-bonding surface.