Light Emitting Module With Concave Micro-Structure Package Layer
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Solution Overview
Problem
Conventional light emitting modules using optical films to uniformize light from LEDs increase module thickness and cost, as they require more LEDs to reduce thickness.
Innovation Solution
A light emitting module with a micro-structure package layer that concaves to form micro-structures over LEDs, reducing the need for optical films and increasing optical efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If optical films such as diffusion plates are stacked to uniformize light and avoid the mura effect, then light uniformity is improved, but module thickness increases
Solution Approach 1:
The package layer is segmented into multiple micro-structure areas, each corresponding to one LED light source. Each micro-structure area contains multiple micro-structures that segment and redirect light from its corresponding LED, achieving uniform light distribution without requiring thick optical films.
Solution Approach 2:
The invention transitions from using optical films (adding thickness in the vertical dimension) to creating micro-structures within the package layer (modifying the horizontal dimension). The micro-structures redirect light laterally to achieve uniformity, eliminating the need for stacked optical films.
2Length of stationary object
If the amount of optical films is reduced to decrease module thickness, then module thickness is reduced, but light uniformity deteriorates
Solution Approach 1:
Different regions of the package layer (micro-structure areas) are given different functions - each area is designed to handle light from its corresponding LED. The micro-structures within each area are locally optimized to redirect light from that specific LED, achieving overall uniformity without needing uniform optical films across the entire module.
3Length of stationary object
If the amount of LEDs is increased to decrease module thickness, then module thickness is reduced, but cost increases
Solution Approach 1:
The invention extracts the light uniformization function from separate optical films and integrates it into the package layer itself. By incorporating micro-structures directly into the package layer, the module eliminates the need for additional optical films while maintaining uniform light output, thereby reducing cost without increasing LED count.
4Illumination intensity
If optical films are used to uniformize light, then light uniformity is improved, but optical efficiency is reduced
Solution Approach 1:
The package layer with micro-structures performs the light uniformization function itself, without requiring external optical films. The micro-structures are self-contained within the package layer and redirect light through internal reflection and refraction, eliminating energy losses that would occur with additional optical film layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves better light uniformity and reduced thickness without the need for extensive optical films, while maintaining high optical efficiency.
Implementation Method 1
The package layer concaves to form a plurality of micro-structures toward the first surface in the micro-structure areas
Implementation Method 2
the micro-structures are disconnected with each other. The orthographic projection of each micro-structure area on the first surface covers the orthographic projection of one of the plurality of light sources
Data Source
AI summary
A light emitting module is disclosed. The light emitting module includes a board, a plurality of light sources, and a package layer. The board includes a first surface. The plurality of light sources are disposed on the first surface. The package layer is disposed on the first surface, which contacts and surrounds the light sources. A plurality of micro-structure areas are defined on the face of the package layer opposite to the first surface, wherein the micro-structure areas are disconnected with each other. The orthographic projection of each micro-structure area on the first surface covers the respective orthographic projection of one of the plurality of light sources on the first surface. The package layer concaves to form a plurality of micro-structures toward the first surface in the micro-structure areas.