LED Module Molding Cover for Heat Dissipation and Protection
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Solution Overview
Problem
Existing LED modules are vulnerable to external environments due to exposed bottom and side surfaces, and the connection schemes in LED channel letters are prone to defects and require full product replacement when a single module fails, lacking efficient heat radiation and humidity protection.
Innovation Solution
The proposed solution involves forming pin holes in the circuit board, inserting pins to stabilize it within a mold, and using a molding cover that extends to cover the upper, lower, and side surfaces, with a heat radiation hole exposing the lower surface for efficient heat dissipation and a sealant to protect the LED, while allowing for modular replacement of faulty units in LED channel letters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a molding cover is formed only on the upper surface of the circuit board, then the manufacturing process is simple, but the bottom surface and side surfaces are exposed to external environment causing poor protection
Solution Approach 1:
The molding cover is extended from covering only the upper surface to covering the bottom surface and side surfaces as well, transitioning from two-dimensional coverage to three-dimensional encapsulation. This dimensional extension ensures all surfaces of the circuit board are protected while maintaining molding process feasibility through proper mold design.
2Stability of the object's composition
If pin holes are formed in the circuit board for positioning, then the circuit board can be stabilized in the mold, but pin marks create routes for humidity and air penetration
Solution Approach 1:
The harmful pin marks are extracted and removed from the circuit board after the molding process. The pins are pulled out from the pin holes, taking the potential moisture penetration routes with them, leaving clean holes that are subsequently sealed by the molding cover material.
Solution Approach 2:
The molding cover material acts as an intermediary that fills and seals the pin holes after pin removal. This intermediary material blocks the moisture penetration routes created by pin marks while maintaining the positioning function achieved during molding.
3Reliability
If the entire bottom surface is covered by molding cover, then protection is improved, but heat radiation from LED is reduced
Solution Approach 1:
The molding cover is designed with differential coverage: the bottom surface is fully covered for protection, while the side surfaces have selective coverage with exposed portions. This local quality variation allows simultaneous achievement of maximum protection and adequate heat radiation pathways.
Data Source
AI summary
Disclosed herein is a method for manufacturing a light emitting diode (LED) module, the method including: disposing a circuit board at a molding space formed by an upper mold and a lower mold; adding a filling material to the molding space; hardening the filling material to form a molding cover covering at least a portion of an upper surface, a lower surface, and a side surface of the circuit board, the molding cover having an opening exposing the lower surface of the circuit board; removing the upper mold and the lower mold from the circuit board; and disposing an LED on the upper surface of the circuit board.