LED Module Mounting Terminals for Solder Alignment
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Solution Overview
Problem
Conventional LED modules often fail to maintain a correct position on circuit boards during surface-mounting due to unbalanced surface tension of molten solder paste acting on limited mounting terminals, leading to potential misalignment.
Innovation Solution
The LED module design includes a lead group with multiple mounting terminals spaced apart in different directions, providing a balanced surface tension during soldering, ensuring accurate positioning and allowing for easy polarity adjustments and enhanced structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If only two mounting terminals are used, then the device complexity is reduced, but the manufacturing precision deteriorates due to unbalanced surface tension causing misalignment
Solution Approach 1:
The mounting terminal structure is segmented into four separate terminals instead of using a single or two-terminal configuration. This segmentation allows the surface tension forces to be distributed at multiple discrete points, creating a balanced force system that prevents rotational moment and ensures accurate mounting position during the reflow process
Solution Approach 2:
The mounting terminals are arranged in a two-dimensional rectangular pattern rather than a linear or single-point configuration. This spatial arrangement in multiple dimensions creates a balanced distribution of surface tension forces acting on the LED module from opposite directions, preventing misalignment while maintaining structural simplicity
2Manufacturing precision
If the lead group structure is changed to add more mounting terminals, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The lead group structure serves multiple functions simultaneously: it provides electrical connection, mechanical support, and mounting attachment. By making the leads themselves serve as the mounting terminals, the design achieves four-point mounting precision without adding separate terminal components, thus improving manufacturing precision while avoiding increased device complexity
Solution Approach 2:
The mounting terminal function is merged with the lead structure. The leads are designed to extend and bend into terminal configurations that serve both as electrical conductors and as mounting attachment points. This merging eliminates the need for separate terminal components, achieving improved mounting precision without increasing overall structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures reliable and accurate surface-mounting of the LED module on circuit boards, preventing misalignment and allowing for adaptable polarity configurations without significant structural changes, while also preventing lead dislodgment.
Implementation Method 1
a resin package covering part of the lead group
Implementation Method 2
when the surface tension of the molten solder paste adhering to the mounting terminal 94A and the mounting terminal 94B do not balance each other
Data Source
AI summary
An LED module A1 includes an LED chip 1, a lead group 4 including a lead 4A on which the LED chip 1 is mounted and a lead 4B spaced apart from the lead 4A, a resin package 2 covering part of the lead group 4, and mounting terminals 41 and 42 provided by part of the lead group 4 that is exposed from the resin package 2 and spaced apart from each other in direction x. The LED module further includes a mounting terminal 43 spaced apart from the mounting terminal 41 in direction y, and a mounting terminal 44 spaced apart from the mounting terminal 42 in direction y. This arrangement allows the LED module A1 to be mounted at a correct position on a circuit board.