LED Module Brightness via Opaque Resin on Silicon Sub-mount
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Solution Overview
Problem
Conventional LED modules suffer from reduced brightness due to light absorption by silicon sub-mount substrates, which hinder the enhancement of light emission.
Innovation Solution
Incorporating an opaque resin, preferably white, around the silicon sub-mount substrate to prevent light absorption, while ensuring electrical connections are maintained without covering the bonding areas, and using a reflector to enhance light directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a silicon sub-mount substrate is used to support the semiconductor layer, then mechanical strength and electrical connection are improved, but light absorption increases and brightness decreases
Solution Approach 1:
A reflective layer is introduced as an intermediary between the silicon sub-mount substrate and the semiconductor layer. This reflective layer prevents direct light absorption by the silicon while maintaining mechanical support and electrical connection functions, thereby resolving the contradiction between structural strength and light emission efficiency
Solution Approach 2:
The harmful light-absorbing function of the silicon sub-mount substrate is extracted by placing a reflective layer on its surface. The reflective layer takes over the function of light management, allowing the silicon substrate to focus solely on mechanical support and electrical connection without the detrimental light absorption effect
2Illumination intensity
If the sub-mount substrate is covered with opaque resin to prevent light absorption, then brightness is improved, but electrical connection may be compromised
Solution Approach 1:
The opaque resin is applied selectively only to the light-emitting regions and sides of the sub-mount substrate, while deliberately leaving the electrical connection areas exposed. This local differentiation allows the resin to prevent light absorption in critical areas without interfering with electrical connections, resolving the contradiction between brightness enhancement and connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances the brightness of the LED module by reflecting light away from the sub-mount substrate and directing it through the sealing resin, while protecting the semiconductor layer from excessive reverse voltage.
Implementation Method 1
opaque resin that does not transmit light from the semiconductor layer... The sub-mount substrate includes a side connected to a surface on which the semiconductor layer is laminated, and the opaque resin covers at least part of the side of the sub-mount substrate
Data Source
AI summary
An LED module 101 is provided with an LED chip 200 that includes a sub-mount substrate 210 made of Si and a semiconductor layer 220 laminated on the sub-mount substrate 210. The module also includes white resin 280 that does not transmit light from the semiconductor layer 220 and that covers at least part of a side of the sub-mount substrate 210, where the side is connected to the surface on which the semiconductor layer 220 is laminated. These arrangements enhance the brightness of the LED module 101.