LED Module Heat Dissipation via PCB Extension Electrodes
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Solution Overview
Problem
Liquid crystal display devices using light emitting diodes face issues with heat radiation efficiency and high product costs, along with low productivity and difficulty in repairing defects.
Innovation Solution
A light emitting diode module with a printed circuit board featuring copper extension electrodes and heat radiation holes, where the first extension electrode is larger than the first electrode and closer to the light emitting chip, and a heat radiation member on the opposite side, enhances heat radiation efficiency and productivity by using a thinner insulating resin base substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal core printed circuit board (MCPCB) is used for heat radiation, then heat radiation efficiency is improved, but product cost increases and productivity decreases
Solution Approach 1:
The patent divides the heat radiation function into two parts: the insulating resin base substrate provides structural support and basic heat dissipation, while separate heat radiation holes (metalized vias) provide enhanced heat conduction pathways. This segmentation allows using a cheaper insulating resin board instead of expensive MCPCB while maintaining heat radiation effectiveness and improving productivity.
Solution Approach 2:
The patent introduces heat radiation holes filled with conductive material as intermediary heat conduction pathways between the LED mounting area and the base substrate. These holes act as thermal mediators that efficiently transfer heat from the high-heat-generation LED region to the larger heat dissipation area of the base substrate, achieving effective heat radiation without requiring a metal core board.
2Temperature
If a metal core printed circuit board (MCPCB) is used for heat radiation, then heat radiation efficiency is improved, but product cost increases
Solution Approach 1:
The patent replaces expensive MCPCB with a cheaper insulating resin base substrate combined with heat radiation holes. The resin board is a lower-cost material that, when combined with the heat radiation hole structure, achieves sufficient heat dissipation performance for the application, thereby reducing product cost while maintaining functionality.
Solution Approach 2:
The patent utilizes heat radiation holes (porous structure) filled with conductive material to create efficient heat conduction pathways. This porous approach allows heat to be conducted through multiple vertical pathways from the LED mounting surface to the base substrate, achieving effective heat radiation using a inexpensive resin board instead of expensive metal core board.
3Temperature
If a metal core printed circuit board (MCPCB) is used for heat radiation, then heat radiation efficiency is improved, but repair difficulty increases
Solution Approach 1:
The patent segments the heat radiation function so that the insulating resin base substrate provides structural support and basic heat dissipation, while heat radiation holes provide enhanced heat conduction. This segmentation creates a modular structure where components can be more easily accessed and repaired compared to integrated MCPCB designs, as the resin board and heat radiation structures can be independently addressed during repair.
4Productivity
If the base substrate thickness is reduced to improve productivity, then manufacturing efficiency increases, but heat radiation capability may be compromised
Solution Approach 1:
The patent compensates for reduced base substrate thickness by adding vertical heat conduction pathways through the heat radiation holes. Instead of relying solely on horizontal heat spread in a thick substrate, the invention creates three-dimensional heat conduction channels that efficiently transport heat vertically from the LED mounting area through the thinner substrate to the heat dissipation surfaces, maintaining heat radiation capability while enabling thinner, more productive manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively radiates heat generated by the light emitting diodes, improving heat radiation efficiency and reducing production costs, while allowing for easier manufacturing and repair of the modules.
Implementation Method 1
a first extension electrode that is formed on the base substrate and is connected to the first electrode; and a second extension electrode that is formed on the base substrate and is connected to the second electrode
Implementation Method 2
a heat radiation member that is formed in a side opposite to a side on which the first extension electrode is formed in the base substrate
Data Source
AI summary
A light emitting diode (LED) module which includes a light emitting diode which includes a light emitting chip, a first electrode and a second electrode, the first and second electrodes being electrically connected to the light emitting chip. The light-emitting diode is supported on a printed circuit board. The printed circuit board includes a base substrate of an insulating resin material, a first extension electrode that is formed on the base substrate and is connected to the first electrode, and a second extension electrode that is formed on the base substrate and is connected to the second electrode.