LED Module PCB Layout for High-Density Linear Light Sources
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Solution Overview
Problem
Conventional light emitting modules, such as those using cold cathode fluorescent lamps, suffer from environmental pollution, slow response rates, and are not suitable for high-density or smaller-sized liquid crystal display panels, while LED-based modules face light interference and efficiency issues due to wire connections.
Innovation Solution
A high-density light emitting module design featuring a printed circuit board with light emitting diode chips arranged on conductive patterns, a connector for electrical connection, and a heat sink, allowing for minimal light interference and increased chip density, with optional resin and reflecting layers for enhanced light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If light emitting diode chips are connected using wires, then electrical connection is achieved, but light interference occurs and light emitting efficiency is degraded
Solution Approach 1:
The patent extracts and removes the wires from the light emitting module structure. Instead of using wires to connect LED chips to the circuit board, the invention directly mounts LED chips onto the circuit board's conductive patterns, eliminating the wire connection and its associated light interference and efficiency loss.
Solution Approach 2:
The patent replaces the mechanical wire connection system with a direct electrical connection system. LED chips are electrically connected to the circuit board through direct contact with conductive patterns on the board surface, substituting the mechanical wire assembly process with a more integrated electrical connection approach.
2Quantity of substance
If more light emitting diode chips are mounted in a predetermined space, then high-density light source is achieved, but chip mounting capacity is limited
Solution Approach 1:
The patent utilizes both surfaces of the circuit board for mounting LED chips. By arranging chips on the front surface and edges, and potentially using the back surface, the invention effectively adds dimensional capacity to the mounting space, allowing significantly more chips to be accommodated within the same footprint area.
Solution Approach 2:
The patent segments the circuit board into multiple mounting zones including front surface areas and edge areas. This segmentation allows independent optimization of chip placement in different regions, maximizing the total number of chips that can be mounted while maintaining proper electrical connections and heat dissipation.
3Quantity of substance
If light emitting diode chips are arranged densely, then high-density linear light source is achieved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent implements localized heat dissipation structures directly at the LED chip mounting locations. Thermal pads or heat sinks are positioned beneath or adjacent to specific chip mounting areas, providing targeted heat removal pathways. This local quality approach ensures that heat from densely packed chips is efficiently managed without requiring the entire board to be designed for high heat flux.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a high-density linear light source with minimal light loss, suitable for applications like TVs, by optimizing LED chip placement and connection methods, improving light efficiency and environmental friendliness.
Implementation Method 1
a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board
Implementation Method 2
a heat sink formed on the bottom of the printed circuit board
Data Source
AI summary
There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.