LED Module Penetration Electrodes for Compact Layout
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Solution Overview
Problem
There is a challenge in reducing the size of LED modules while maintaining their functionality, particularly in accommodating LED chips and their associated electrodes and wires within a smaller substrate space, without compromising the reliability of the electrical connections and the manufacturing process.
Innovation Solution
The LED module design incorporates a substrate with penetration electrodes and a rear surface electrode, along with an insulating film and bonding layers, which allows for a more compact layout by eliminating the need for additional space on the substrate surface for electrode connections and enabling efficient wire bonding, while also simplifying the manufacturing process by reducing the complexity of the case design and adhesion layer application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the substrate width is reduced to decrease the projection height, then the size of the LED module is reduced, but the space for accommodating LED chips and electrodes becomes insufficient
Solution Approach 1:
The patent transitions from a conventional planar electrode arrangement to a three-dimensional structure by forming electrodes that extend in the thickness direction of the substrate. The side surface electrodes protrude from the substrate surface, utilizing the vertical dimension to accommodate electrical connections without increasing the substrate's planar area. This dimensional transition resolves the contradiction by providing sufficient electrode space while maintaining a compact substrate width.
Solution Approach 2:
The patent employs a nested arrangement where the side surface electrodes are integrated into the substrate structure, with the case surrounding the LED chips and electrodes in a compact configuration. The penetration electrodes extend through the substrate thickness, nesting the electrical connection path within the substrate's vertical dimension rather than requiring additional lateral space.
2Length of stationary object
If the substrate width is reduced to decrease the projection height, then the size of the LED module is reduced, but the area allocated for electrodes becomes insufficient
Solution Approach 1:
The patent forms electrodes that extend in the thickness direction of the substrate, with side surface electrodes protruding from the substrate surface. This vertical extension provides adequate electrode area without increasing the substrate's planar dimensions, directly resolving the contradiction between reduced substrate width and sufficient electrode area.
Solution Approach 2:
The patent concentrates the electrode structure at specific locations where electrical connections are needed, with side surface electrodes positioned to optimize space utilization. The electrodes are strategically arranged to provide sufficient connection area only where required, rather than uniformly distributing electrode material across the entire substrate surface.
3Length of stationary object
If the LED module size is reduced, then the projection height is decreased, but the complexity of accommodating wires and electrodes increases
Solution Approach 1:
The patent merges the function of multiple electrical connections into an integrated electrode structure. The side surface electrodes and penetration electrodes work together as a unified electrical connection system, eliminating the need for separate wire routing paths and reducing the overall complexity of the electrical arrangement within the compact module.
Solution Approach 2:
By extending electrodes in the thickness direction and allowing them to protrude from the substrate surface, the patent creates a three-dimensional electrical connection architecture. This vertical arrangement simplifies wire bonding by providing accessible electrode surfaces, reducing the complexity of routing wires through a confined planar space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the size of the LED module while ensuring reliable electrical connections and streamlining the manufacturing process, avoiding issues like short-circuiting and reducing manufacturing costs by eliminating the need for additional molds and recesses.
Implementation Method 1
The LED chips 931, 932 and 933 are configured to emit red light, green light and blue light, respectively
Implementation Method 2
These three types of light emitted from the LED chips 931, 932 and 933 are mixed with one another so that the LED module 900 can emit white light
Data Source
AI summary
An LED module includes a substrate having a main surface and a rear surface located opposite the main surface, a main surface electrode located on the main surface, a plurality of penetration electrodes connected to the main surface electrode and extending through the substrate, three or more LED chips arranged on the main surface electrode along a first direction, and a case arranged on the main surface to surround the main surface electrode. The LED chips include at least one LED chip that can emit red light, at least one LED chip that can emit green light and at least one LED chip that can emit blue light.