LED Module Layout for Uniform Planar Light Across Series-Parallel Strings
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Solution Overview
Problem
Existing light emitting modules using series-parallel connected LED chips face issues with non-uniform planar light emission due to forward voltage differences between strings, which are exacerbated by performance changes over time, leading to inconsistent lighting.
Innovation Solution
The LED chips are arranged in multiple groups connected in series within each group and in parallel across groups, with each group distributed non-contiguously on the circuit board to maintain uniformity, and the circuit board is divided into regions to ensure even distribution of LED chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If light emitting diode chips are connected in series to drive high voltage power source, then the driving circuit can be simplified, but forward voltage differences between strings cause non-uniform planar light
Solution Approach 1:
The patent divides the light emitting diode chips into multiple groups (first group, second group, third group) that are interconnected through a bridge circuit. This segmentation allows the system to maintain series connection for voltage matching while creating parallel paths that balance forward voltage differences, thus resolving the contradiction between simplified driving circuit and uniform light emission.
Solution Approach 2:
The bridge circuit acts as an intermediary component that connects the multiple groups of light emitting diode chips. It provides a pathway to balance voltage differences between strings without requiring complex driving circuitry, thereby maintaining both circuit simplicity and light uniformity.
2Illumination intensity
If light emitting diode chips are selected with same forward voltage, then uniform planar light can be provided, but production yield decreases due to strict selection requirements
Solution Approach 1:
The patent changes the electrical configuration parameter by introducing a bridge circuit that creates multiple current paths. This allows light emitting diode chips with varying forward voltages to be connected in a way that balances the overall voltage distribution, eliminating the need for strict forward voltage matching and thereby increasing production yield while maintaining light uniformity.
3Device complexity
If series-parallel structure is employed to simplify driving circuit, then large number of light emitting diode chips can be driven simultaneously, but performance changes over time cause forward voltage differences and non-uniform light
Solution Approach 1:
The bridge circuit provides dynamic voltage balancing by allowing current to flow through different paths depending on the instantaneous forward voltage characteristics of each light emitting diode chip. As chips age and their characteristics change, the bridge circuit automatically redistributes current to maintain balanced voltage distribution, ensuring long-term reliability and consistent planar light output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement ensures uniform planar light emission even when individual LED chips fail or experience performance changes, maintaining consistent lighting over time.
Implementation Method 1
A light emitting module according to the present invention includes: light emitting diode chips arranged in a plurality of regions on a circuit board
Data Source
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AI summary
A light emitting module according to an exemplary embodiment of the present disclosure includes: a circuit board; and light emitting diode chips arranged in a plurality of regions on the circuit board, in which the light emitting diode chips are divided into a plurality of light emitting diode groups connected in series, the plurality of light emitting diode groups is connected in parallel to one another, and at least one of the light emitting diode chips in at least one of the plurality of light emitting diode groups is disposed in a region different from that of at least one other light emitting diode chip.