LED Module With Pressure Multiplying Pads For Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current LED lighting devices face challenges in achieving high light output in a compact package while maintaining efficient heat dissipation and directional light control, particularly in sports and entertainment facilities.
Innovation Solution
The design incorporates a substrate with pressure multiplying pads and a flexible lens cover for an LED module, which includes a heat sink body for efficient heat dissipation and directional light emission, using a parylene coating for thermal transfer and a thermally conductive, electrically non-conductive layer to separate LEDs from the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact LED module design is used to achieve high light output in a small package, then the device size is reduced and light density is improved, but heat dissipation becomes more difficult due to limited space for heat sinks and thermal management components
Solution Approach 1:
The substrate is designed to perform dual functions: as the mounting platform for LEDs and as a heat dissipation component. The pressure multiplying pads extend from the substrate and directly contact the heat sink, creating an integrated thermal management system that eliminates the need for separate thermal pathways, thereby improving heat dissipation efficiency while maintaining compact dimensions.
Solution Approach 2:
Pressure multiplying pads extend vertically from the substrate surface to contact the heat sink, utilizing the third dimension (height) to establish thermal contact. This vertical extension allows efficient heat transfer from the LED-mounted upper surface to the heat sink without increasing the horizontal footprint of the module, thus maintaining compact size while improving heat dissipation.
2Temperature
If pressure multiplying pads are extended beyond substrate sidewalls to improve heat transfer to the heat sink, then thermal contact is enhanced, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The pressure multiplying pads are integrally formed with the substrate as a single piece, eliminating the need for separate manufacturing steps to attach pads to the substrate. This integration simplifies manufacturing by reducing assembly operations and potential failure points, while still achieving enhanced thermal contact through the extended pad geometry.
Solution Approach 2:
The substrate geometry is modified by extending certain regions (pressure multiplying pads) beyond the main substrate sidewalls. This parameter change in the substrate shape allows direct contact with the heat sink surface, improving thermal transfer efficiency without requiring additional components or complex assembly procedures.
3Illumination intensity
If a flexible lens cover is used to direct light in multiple directions, then light distribution and directionality are improved, but the complexity of assembling and positioning the lens cover increases
Solution Approach 1:
A flexible lens cover is positioned over the LED array to shape and direct light output. The flexibility of this thin film component allows it to conform to the substrate and ridge structure, providing effective light directionality while simplifying assembly through its ability to flex into position rather than requiring precise rigid alignment.
Solution Approach 2:
The lens cover is shaped with curved surfaces that fit over the substrate and around the ridge structure. This curvature allows the lens to effectively redirect light in multiple directions while conforming to the module's geometry, achieving good light distribution without complex assembly requirements.
4Reliability
If LEDs are electrically separated from the substrate using a thermally conductive layer, then electrical isolation is achieved, but the thermal conduction path may be interrupted
Solution Approach 1:
The substrate is designed with regions of different electrical properties: areas under the LEDs are coated with electrically non-conductive material to provide isolation, while areas with pressure multiplying pads maintain electrical conductivity for heat transfer. This local differentiation of material properties allows simultaneous achievement of electrical isolation where needed and thermal conduction where required.
Solution Approach 2:
A thermally conductive, electrically non-conductive layer is positioned between the LEDs and substrate to provide electrical isolation while maintaining thermal contact. This intermediary material acts as a mediator that allows heat transfer while preventing electrical short circuits, resolving the contradiction between electrical safety and thermal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation and light directionality, allowing for high-intensity LED devices with improved energy efficiency and compact design, addressing the need for advanced LED lighting solutions.
Implementation Method 1
the parylene material is a part of the pressure multiplying pads and provides a thermal transfer function between the pressure multiplying pads and the heat sink body
Implementation Method 2
a layer of electrically non-conductive, thermally conductive material positioned between the conductive lines and the upper surface so that, in operation, the LEDs and conductive lines are electrically separated from the substrate while heat from the LEDs passes through the layer to the substrate
Implementation Method 3
a heat sink body for efficient heat dissipation
Implementation Method 4
a heat sink body for efficient heat dissipation
Data Source
AI summary
A light emitting diode (LED) module for a light fixture includes a substrate with an upper surface and a lower surface. Various pressure multiplying pads are integrally connected to the lower surface, and each pressure multiplying pad extends away from the lower surface. LEDs are attached to the upper surface, along with a set of conductive lines so that each conductive line electrically connects a corresponding LED to a power inputs. Each of the pressure multiplying pads may be positioned opposite a corresponding LED. A flexible lens cover may cover the upper surface and the LEDs, while leaving the lower surface and pressure multiplying pads exposed so that the pads can contact a heat sink of the light fixture.