LED Module Recessed Lens Fastening
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Solution Overview
Problem
Current LED modules face challenges in achieving uniform optical characteristics and high reliability due to deviations in luminance and color, leading to increased manufacturing costs and reduced yield, especially in modularized structures where multiple mounting processes can introduce inefficiencies and inferiorities.
Innovation Solution
The LED module features a substrate with a recessed surface where an electrode is directly placed without overlapping the recess, allowing a lens to be securely fastened by filling the recess with a lens forming material, which covers the electrode, phosphor layer, and LED chip, enhancing adhesion and reducing the likelihood of lens detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a lens is provided to the module substrate in COB type, then heat radiation efficiency is improved by shortening heat transfer path, but the lens may be separated reducing reliability
Solution Approach 1:
The substrate surface is segmented into a flat mounting area and a recessed lens receiving area. The recess divides the lens mounting space from the LED chip area, providing mechanical support and preventing lens separation while maintaining direct contact for heat radiation.
Solution Approach 2:
The lens is nested within the recess formed on the substrate surface. The recess acts as a cavity that houses the lens, securing it in place through the contour match between the lens outer surface and the recess inner surface, preventing separation while maintaining compact structure.
2Manufacturing precision
If LEDs are binned to achieve uniform optical characteristics, then luminance and color uniformity is improved, but yield is decreased and manufacturing cost is increased
Solution Approach 1:
The recess provides a localized mounting structure that ensures precise lens positioning and consistent optical characteristics without requiring strict binning of LED chips. The uniform recess geometry across all modules ensures consistent optical performance regardless of LED chip variations.
3Ease of manufacture
If modularized structure with multiple mounting processes is used, then device assembly is simplified, but inferiority rate increases and price increases
Solution Approach 1:
The lens mounting and LED chip mounting are merged into a single substrate structure. The recess is formed directly on the substrate, allowing the lens to be mounted in the same manufacturing step as the LED chip assembly, eliminating separate mounting processes and reducing inferiority rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases the reliability and uniformity of LED modules by ensuring secure lens attachment, reducing manufacturing costs, and improving heat radiation efficiency, while maintaining high optical performance and reducing the module size.
Implementation Method 1
a lens directly disposed on the upper plane surface of the substrate and fastened to the substrate through the recess, wherein the lens is fastened to the substrate by filling the recess with a lens forming material
Data Source
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AI summary
A light emitting diode (LED) module is disclosed. The LED module includes a substrate formed with a recess, and a lens fastened to the substrate through the recess. Therefore, escape of the lens from the substrate may be prevented. During forming of the lens, a lens forming material fills the recess so that the substrate and the lens are fastened to each other. Thus, the lens may be attached to the substrate without a dedicated adhesive. Also, the lens is not easily separated by an external shock, thereby increasing reliability of the LED module. Moreover, since the lens is formed directly on the substrate by a chip-on-board (COB) method, the manufacturing cost may be reduced. Also, heat radiation efficiency may be increased by shortening a heat transfer path.