LED Module With Recessed PCB And Color Conversion
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Solution Overview
Problem
Existing light-emitting diode (LED) arrangements face challenges in achieving a balance between effective heat dissipation and dielectric strength, with conventional methods either impairing heat dissipation or risking voltage breakdown.
Innovation Solution
The proposed solution involves a light-emitting diode arrangement with a thermally conductive carrier and a printed circuit board featuring recesses filled with color conversion material, where LED chips are directly attached to a metallic heat sink, and the thickness and concentration of the color conversion material are optimized for wavelength shift and heat management, ensuring good thermal conductivity and dielectric strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air or gas is used in the light emission direction around the walls, then dielectric strength is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent applies different materials in different regions: air/gas is used in the light emission direction for dielectric strength, while thermally conductive material is used in the heat dissipation direction for thermal management. This spatial differentiation of material properties resolves the contradiction between insulation and heat dissipation requirements.
2Temperature
If a thermally conductive material is used for heat dissipation, then heat dissipation is improved, but dielectric strength deteriorates
Solution Approach 1:
The patent implements directional material placement where thermally conductive material is positioned specifically in the heat dissipation path while maintaining air gaps or insulating barriers in the light emission direction. This localized quality assignment allows simultaneous optimization of both thermal and electrical properties.
Solution Approach 2:
The patent transitions from a single-material approach to a multi-dimensional material distribution strategy, utilizing spatial arrangement in different directions (heat dissipation direction vs. light emission direction) to satisfy conflicting requirements. The structural dimensionality enables independent optimization of thermal and electrical characteristics.
3Temperature
If a thick copper sheet heat sink is used, then heat dissipation is improved, but voltage breakdown risk increases
Solution Approach 1:
The patent replaces the uniform thick copper sheet with a directionally optimized structure that provides thermal conductivity where needed while maintaining electrical insulation in the light emission direction through air gaps or insulating materials, thus preventing voltage breakdown while preserving heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation and high dielectric strength, achieving a compromise between temperature regulation and voltage safety while producing homogeneous white light through optimized color conversion.
Implementation Method 1
a color conversion material that converts at least a part of the light emitted from the light-emitting diode chip into light of a different wavelength
Implementation Method 2
a preferably thermally conductive carrier
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
The invention relates to a light-emitting diode arrangement having the following: a preferably heat-conductive substrate (2); a printed circuit board (5) which is arranged on the substrate (2), a recess (9) being provided in the printed circuit board (5); and at least one light-emitting diode chip (3) which is arranged on the substrate (2) and in the recess (9), said recess (9) being at least partly filled with at least one matrix material which preferably has a color-converting material (8).