LED Module with Integrated Heat Sink and Reflector for Light Direction
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Solution Overview
Problem
Conventional LED lighting systems face challenges in directing light output effectively to a desired angle and pattern, leading to light wastage and reduced lumens, and struggle with heat dissipation, necessitating a more efficient configuration for improved illumination.
Innovation Solution
The solution involves an LED module with a heat sink and reflector module that allows for adjustable light direction by positioning LED chips horizontally on a carrier plate, enabling precise control of light emission angles and patterns, and facilitating efficient heat dissipation through extruded heat-sink modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If lenses and prisms are used to control light direction, then illumination angle and pattern are improved, but lumens are lost due to material absorption
Solution Approach 1:
The patent replaces optical control systems (lenses and prisms) with a reflective surface system. The reflective surface redirects light from the LED without absorbing it, eliminating the lumens loss that occurs with refractive optical elements while maintaining control over light direction and illumination patterns.
Solution Approach 2:
The patent introduces a reflective surface as an intermediary between the LED and the desired illumination area. This intermediary redirects light paths without the energy loss associated with direct refractive control, serving as a mediator that preserves lumens while achieving angular control.
2Loss of energy
If reflective surfaces are used to direct light, then lumens are preserved, but configuration complexity increases to achieve desired illumination patterns
Solution Approach 1:
The patent applies different reflective surface configurations to different regions of the LED array. By varying the orientation and positioning of reflective surfaces locally across the LED board, the system achieves diverse illumination patterns without requiring a single complex overall structure, thus managing configuration complexity through localized optimization.
3Temperature
If heat sinks are added to dissipate heat, then thermal management is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent merges the heat sink functionality with the existing LED module structure. The heat sink is integrated directly into the LED assembly, combining thermal management with the optical and electrical components, thereby improving heat dissipation without proportionally increasing overall device complexity.
Solution Approach 2:
The heat sink structure serves multiple functions: it dissipates heat from the LED, provides mechanical support for the LED assembly, and can be configured to work with different LED arrangements. This multi-functionality reduces the need for separate structural components, managing complexity through functional integration.
4Ease of manufacture
If conventional LED modules are used, then manufacturing is simple, but light direction control and illumination patterns are limited
Solution Approach 1:
The patent segments the LED array into individual controllable modules, each with its own reflective surface configuration. This segmentation allows independent optimization of light direction for each module while maintaining the simplicity of individual module manufacturing, achieving complex illumination patterns through modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases candlepower by up to 250% and allows for accurate aiming of light, achieving distinct lighting distributions with the ability to replace individual LED modules, reducing waste and enhancing energy efficiency.
Implementation Method 1
a heat sink formed of heat transmitting material and having a mounting surface for accommodating the LED circuit board to dissipate heat from the LED chip(s)
Implementation Method 2
a reflector with its reflective surface disposed with respect to the LED chip(s) to direct the emitted light emitted toward an axis of illumination
Data Source
AI summary
LED module, arrays of LED modules, luminaires incorporating such arrays, and methods of illumination where the configuration of respective components facilitates any one or more of desired angle, location and shape of illumination provided by the LEDs. LED modules are selectively disposed on a carrier plate. Each of the LED modules includes a substantially planar LED circuit board with LED chips disposed thereon, a heat sink formed of heat transmitting material and having a mounting surface for accommodating an LED circuit board to dissipate heat from the LED chips, and a reflector with its reflective surface disposed with respect to the LED chips to direct the emitted light toward an axis of illumination extending away from and substantially perpendicular to a plane containing the planar LED circuit board. The heat sink, the LED circuit board and the reflector are arranged such that the axis of illumination is not perpendicular to a plane containing the surface illuminated by the light emitted from the LED chips.