LED Module Resin Case Area Contact Inhibitor
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Solution Overview
Problem
Conventional LED modules with soft resin reflectors tend to adhere to each other when transported in a parts feeder, making it difficult to handle and process multiple modules effectively due to their large surface area contact.
Innovation Solution
The LED module design incorporates a resin case with a frame-like part featuring a reflective surface and an area contact inhibitor on its outer surface, which includes planar portions and a step configuration to reduce contact area with adjacent modules, preventing adherence during transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a soft resin reflector with large surface area is used, then light reflection efficiency is improved, but modules adhere to each other during transport
Solution Approach 1:
The outer surface of the resin case is divided into multiple protrusions that are spaced apart from each other. This segmentation reduces the continuous contact area between adjacent modules from a large planar surface to discrete small points, preventing adhesion while preserving the light-reflecting frame-like structure.
Solution Approach 2:
The design transitions from a two-dimensional planar reflective surface to a three-dimensional structure with protrusions extending outward. This adds vertical dimensionality to the reflective surface, allowing the light-reflecting function to be maintained while the protruding geometry reduces horizontal contact area between modules.
2Reliability
If a soft resin material is used for the resin case, then durability and heat dissipation are improved, but adhesive property increases causing modules to stick together
Solution Approach 1:
The resin case exhibits different properties in different regions: the frame-like part with protrusions has reduced contact area to prevent adhesion, while the bulk resin material maintains softness for durability and heat dissipation. The protrusions create localized non-contact zones while the overall soft resin structure provides the desired mechanical and thermal properties.
Solution Approach 2:
The high adhesive property of the soft resin, which initially causes unwanted attachment between modules, is converted into a benefit by shaping the resin into protrusions. The adhesive resin material now serves to seal and protect the LED chip while the protrusion geometry ensures that the adhesive property does not cause module-to-module adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The area contact inhibitor effectively prevents surface adhesion between LED modules, facilitating easier handling and processing, while the soft resin case with silicon content enhances durability and heat dissipation.
Implementation Method 1
a resin case having a reflective surface formed on an inner side of the resin case to surround the LED chip
Implementation Method 2
The resin case is made of a silicon resin or a resin containing a silicon resin as a main ingredient
Data Source
AI summary
An LED module includes: an LED chip; and a resin case having a reflective surface surrounding the LED chip. An area contact inhibitor to inhibit area contact with an adjacent LED module is formed on an outer surface of the resin case.