LED Module with Transparent Resin and Reflection Member
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Solution Overview
Problem
Conventional LED packages face challenges in achieving high durability and cost-effectiveness, particularly when used in applications like liquid crystal display backlights and illumination, where they require improved light distribution and efficiency without the limitations of polyamide thermoplastic resin envelopes that can absorb light and heat, leading to deterioration.
Innovation Solution
The LED module design features a substrate with an interconnect layer and a reflection member, where LED packages are mounted without a bowl-shaped envelope, using a transparent silicone resin body that covers parts of the lead frames and exposes others, enhancing light extraction and durability while reducing manufacturing costs through a simplified process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bowl-shaped envelope made of polyamide thermoplastic resin is used to control light distribution and enhance light extraction efficiency, then light extraction efficiency is improved, but the envelope absorbs light and heat leading to deterioration and reduced durability
Solution Approach 1:
The patent removes the bowl-shaped polyamide thermoplastic resin envelope from the LED package structure. Instead, it uses a transparent resin body that directly covers the LED chip and lead frames, eliminating the component responsible for light and heat absorption while maintaining light distribution control through the transparent resin's optical properties
Solution Approach 2:
The patent employs a composite structure consisting of a transparent resin body (such as silicone resin) that combines light transmission capabilities with durability. This composite material approach replaces the single-material envelope structure with a multi-material system that achieves both light extraction efficiency and resistance to deterioration
2Reliability
If a transparent resin body is used to cover LED chips without a bowl-shaped envelope, then durability is improved by eliminating light and heat absorption, but light distribution control becomes more challenging
Solution Approach 1:
The patent applies local quality by designing the transparent resin body with specific regional characteristics - certain areas have different refractive indices or surface treatments to control light distribution in specific directions. The resin body may include internal structures or surface features in localized regions to achieve optimal light extraction and distribution patterns
3Ease of manufacture
If the polyamide thermoplastic resin envelope is removed to reduce costs and simplify manufacturing, then manufacturing cost is reduced, but light extraction efficiency may deteriorate
Solution Approach 1:
The patent eliminates the expensive polyamide thermoplastic resin envelope component, reducing material costs and manufacturing complexity. The simplified structure uses fewer components and assembly steps while maintaining or improving light extraction efficiency through the optimized transparent resin body design
Solution Approach 2:
The patent optimizes parameters of the transparent resin body such as refractive index, thickness, and surface characteristics to maximize light extraction efficiency. By carefully controlling these parameters, the system achieves high light extraction without requiring the additional envelope structure, thereby reducing manufacturing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the durability and reliability of LED packages, allowing for wide-angle light emission suitable for various applications, including liquid crystal display backlights, with improved light efficiency and reduced manufacturing costs due to the absence of an envelope and simplified production processes.
Implementation Method 1
The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package
Implementation Method 2
using a transparent silicone resin body that covers parts of the lead frames and exposes others, enhancing light extraction
Data Source
AI summary
According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.