LED Light Source Module Using Double-Sided PCB Rivet Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing processes for LED light source modules, particularly the copper sinking process, are costly due to high environmental pollution and the need for expensive substrates, which hinders cost reduction and product competitiveness.
Innovation Solution
An LED light source module using a double-sided circuit board with a rivet electrically connected to both sides, where the rivet is inserted through a perforation to connect the wiring layouts, eliminating the need for copper sinking and allowing the use of lower-grade composite substrates like paper-based materials, and a patch machine with a suction nozzle for assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper sinking process is used to electrically connect electronic components and LED chips on both sides of the circuit board, then reliable electrical connection is achieved, but manufacturing cost increases and environmental pollution occurs
Solution Approach 1:
The patent extracts and eliminates the copper sinking process from the manufacturing workflow, replacing it with a rivet-based mechanical and electrical connection system. This removal of the harmful process directly addresses both the pollution issue and the high manufacturing cost associated with copper plating, while maintaining electrical connection functionality through the rivet structure.
Solution Approach 2:
The patent employs rivets as inexpensive, simple metal fasteners that provide both mechanical anchoring and electrical connection without requiring expensive copper plating processes. The rivets serve as disposable or replaceable components that achieve the electrical connection function at significantly lower cost and without environmental harm.
2Reliability
If copper sinking process is used for electrical connection, then electrical connectivity is achieved, but substrate material options are limited to expensive fiberglass cloth
Solution Approach 1:
By removing the copper sinking process requirement, the patent frees the substrate material selection from the constraint of needing high-temperature resistance. This allows the use of composite boards with paper-based substrates that are cheaper and more versatile, while the rivet provides electrical connection without requiring the substrate to withstand plating process temperatures.
Solution Approach 2:
The patent changes the connection mechanism from a high-temperature chemical process (copper sinking) to a low-temperature mechanical process (rivet insertion). This parameter change in process temperature enables the use of a broader range of substrate materials including paper-based composites that would decompose at copper plating temperatures.
3Reliability
If high-temperature copper sinking process is used, then electrical connection is achieved, but pollution control costs increase
Solution Approach 1:
The patent converts the harmful high-temperature copper sinking process into a beneficial low-temperature rivet insertion process. By eliminating the harmful thermal and chemical aspects of copper plating, the solution achieves electrical connection through a cleaner mechanical process that uses simpler metal rivets without generating toxic waste or requiring expensive pollution control measures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces material costs, minimizes pollution control costs, and eliminates the need for high-temperature processes, thereby lowering the overall cost of the LED light source module and enhancing its competitiveness.
Implementation Method 1
The rivet comprises a nail head, a shank, and a transition section connecting the nail head and the shank. The length of the nail head in the cross section along the thickness direction of the circuit substrate is greater than the width of the shank, and the transition section is a trapezoid, the short side of the trapezoid is connected to the shank, the length of the long side of the trapezoid is smaller than the length of the nail head. The nail head is electrically connected to the first wiring layout, and the shank is electrically connected to the second wiring layout by soldering.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An LED light source module (100) comprises a double-sided circuit board (10) and two rivets (20) electrically connected to both sides of the double-sided circuit board (10). The rivet includes a nail head (21), a shank (22), and a transition section (23) connecting the nail head and the shank. The length of the nail head (21) in a section along the thickness direction of the circuit substrate (11) is greater than the width of the shank (22), and the transition section (23) is a trapezoid. The short side of the trapezoid is connected to the shank (22), and the length of the long side of the trapezoid is smaller than the length of the nail head (21). The nail head (21) is connected to the first wiring layout (12), and the shank (22) is electrically connected to the second wire pattern (13) by soldering tin. The first (12) and second (13) wiring layouts are electrically connected by the rivet (20), and the copper plating process with more serious pollution is not used, thereby reducing the cost of pollution control, and the circuit substrate (11) of the lower-level material can be used, and further the competitiveness of the lamp having the LED light source module (100) can be improved.