LED Display Module Encapsulation Slope for Seam Light Leakage

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Solution Overview

Problem

LED display modules exhibit light leakage and bright lines at joints due to light transmission from the seams, causing issues like yellow, cyan, pink, or white bright lines when viewed from a large angle.

Innovation Solution

A display module design featuring a board with a pixel unit array covered by an encapsulation layer and a black ink layer, where the encapsulation layer has a slope surface at its edge, and the black ink layer fully covers this slope, reducing light leakage by refraction and ensuring uniform coverage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple LED display modules are stitched together to form a large area display, then the display area and resolution are improved, but light leakage and bright lines occur at the joints

Engineering Contradiction:
Improvedisplay areaVSAvoidlight leakage at joints
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The patent introduces a slope surface structure as an intermediary element between adjacent display modules at the joints. This slope surface acts as a light-trapping structure that intercepts and redirects light that would otherwise leak through the joint gaps, thereby eliminating bright lines while preserving the large area display capability

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent addresses the light leakage problem by transitioning from a two-dimensional planar joint surface to a three-dimensional slope surface structure. The slope surface introduces a new dimensional aspect (inclination angle) that enables light redirection and trapping, effectively solving the joint light leakage issue in multi-module displays

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Object-generated harmful factors

If a slope surface is formed on the encapsulation layer at the joint edges, then light leakage at joints is reduced, but the manufacturing process complexity increases

Engineering Contradiction:
Improvelight leakage at jointsVSAvoidmanufacturing process complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The patent controls the complexity by defining specific parameter ranges for the slope surface: the inclination angle is limited to 45-60 degrees and the width to 0.5-2mm. These parameter constraints ensure that the slope surface can be manufactured using conventional processes while maintaining effective light leakage reduction

Inventive Principle:
Principle #35Parameter changes

3Illumination intensity

If the black ink layer fully covers the slope surface, then light emission uniformity is improved, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvelight emission uniformityVSAvoidblack ink layer coverage precision
Core Design Contradiction:
Illumination intensityVSManufacturing precision

Solution Approach 1:

The patent specifies that the black ink layer should have a thickness of 1-5μm when covering the slope surface. This controlled thickness parameter ensures uniform light emission while providing clear manufacturing guidelines that reduce the precision burden compared to uncontrolled coating processes

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves light emitting uniformity, enhances dislocation compatibility, and facilitates efficient apparatus assembly by minimizing light transmission and bright lines at joints.

Implementation Method 1

A side surface of the encapsulation layer forms a slope surface at an edge of the front surface of the board

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS12575452B2Display module and manufacturing method therefor, and LED display panel and LED display apparatus
Publication Date: 2026.03.10 HCP TECH CO LTD
  • US12575452B2 patent drawing
  • US12575452B2 patent drawing
  • US12575452B2 patent drawing

AI summary

Provided are a display module and a manufacturing method therefor, an LED display panel and an LED display apparatus. The display module includes a board, a pixel unit array, an encapsulation layer and a black ink layer. The board has a front surface and a back surface. The pixel unit array is disposed on the front surface of the board. The encapsulation layer covers the region where the pixel unit array is located. A side surface of the encapsulation layer forms a slope surface at an edge of the front surface of the board. The black ink layer covers the encapsulation layer.