LED Module Heat Radiating Part with Segmented Fins
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Solution Overview
Problem
Existing LED modules, particularly SMD type, have low heat radiation efficiency, leading to increased heat emissions and potential deformation and color issues, while top electrode LED modules face limitations in securing necessary heat radiation areas and assembling mechanisms.
Innovation Solution
An LED module design that includes a light emitting part, a board part electrically connected to the light emitting part, and a heat radiating part with surface treatments such as anodizing or thermal coating, featuring a heat radiating part boss to protect electric lines and integrate the board and heat radiating parts for enhanced heat dissipation without a separate assembly structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If top electrode LED modules use plate type heat radiating components, then heat radiation efficiency is considerably increased, but there are limitations in securing shapes and sizes for satisfying necessary heat radiation areas and assembling peripheral mechanisms
Solution Approach 1:
The heat radiating component is divided into multiple fin structures that extend from the plate body, creating segmented heat radiation surfaces. This segmentation allows the component to achieve greater total heat radiation area while maintaining a compact base plate structure, resolving the contradiction between heat radiation efficiency and shape flexibility.
Solution Approach 2:
The heat radiating component transitions from a two-dimensional plate structure to a three-dimensional structure with extended fins. By adding vertical dimension through the fins, the component achieves significantly increased heat radiation area without proportionally increasing the base plate size, thus maintaining adaptability for various mounting configurations.
2Reliability
If separate wiring lines and PCB board are used for supplying electric currents, then electrical connection is achieved, but assembly structure becomes more complex
Solution Approach 1:
The wiring lines are integrated directly into the heat radiating component structure, merging the electrical connection function with the heat radiation function. This integration eliminates the need for separate PCB boards and external wiring, reducing assembly complexity while maintaining reliable electrical connection to the LED components.
Solution Approach 2:
The heat radiating component serves multiple functions simultaneously: it provides heat radiation surfaces, contains electrical wiring lines, and acts as a structural mounting platform. This multi-functionality reduces the total number of separate components needed, simplifying the overall assembly structure while ensuring reliable electrical connections.
3Loss of energy
If heat radiating components are made larger to increase heat radiation area, then heat radiation efficiency is improved, but size and weight of the LED module increase
Solution Approach 1:
The heat radiation area is segmented into multiple thin fin structures rather than a single large plate. This segmentation allows the heat radiation surfaces to be distributed efficiently, achieving high total area while maintaining minimal material usage and reduced weight, as the fins can be made thin and lightweight.
Solution Approach 2:
Instead of increasing heat radiation area by expanding the base plate horizontally, the design extends fins vertically into the third dimension. This dimensional transition achieves significantly increased heat radiation area without proportionally increasing the footprint or weight of the component, as the fins add area with minimal material addition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat radiation performance, reduces the size and weight of the LED module, protects electric lines, and simplifies assembly, thereby increasing the module's lifespan and productivity while minimizing manufacturing costs.
Implementation Method 1
transfers heat generated by LEDs to air through a PCB board and heat radiation component
Implementation Method 2
heat radiation efficiency is relatively low
Implementation Method 3
the surface treatment may be anodizing
Implementation Method 4
the surface treatment may be thermal coating
Implementation Method 5
an outer surface of the heat radiating part may be black colored through the surface treatment
Data Source
AI summary
An LED module includes a light emitting part, a board part electrically connected to the light emitting part, and a heat radiating part disposed on a lower side of the light emitting part and the board part, and a surface treatment is applied to the heat radiating part.