LED Module Shared Electrode Design for Mass Transfer Yield

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Solution Overview

Problem

The traditional massive transfer process for LED chips in display panels is inefficient, leading to low yield, increased production costs, and difficulty in repair due to the large number of transfers required for different colored LED chips.

Innovation Solution

The design of an LED module comprising multiple LED chips sharing a common electrode, allowing for these modules to be transferred as a single unit, reducing the number of transfers and enabling more efficient production while maintaining display quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If LED chips are transferred individually in massive transfer process, then the number of LED chips transferred per process is large, but the yield is low and production time is long

Engineering Contradiction:

Improveproduction efficiencyVSAvoidyield

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

Multiple LED chips are combined into a single LED module with shared electrodes, transforming individual chip transfers into module-level transfers. This merging approach maintains high productivity while improving yield by reducing the total number of transfer operations required.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The LED module is designed as a segmented structure where multiple chips share common electrodes, allowing the module to be treated as a single transfer unit while maintaining internal chip independence for functionality. This segmentation enables efficient mass transfer without compromising individual chip performance.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If multiple LED chips are transferred separately, then each chip can be precisely positioned, but the number of transfers increases and costs increase

Engineering Contradiction:

Improvepositioning accuracyVSAvoidproduction cycle

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

Multiple LED chips are merged into a single module structure with shared electrodes, enabling simultaneous transfer and positioning of multiple chips as one unit. This reduces the production cycle while maintaining positioning accuracy through the module's integrated design.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The LED chips are pre-assembled into modules with shared electrodes before transfer, performing the positioning and connection work in advance. This preliminary action reduces the number of subsequent transfer operations and shortens the overall production cycle.

Inventive Principle:

Principle #10Preliminary action

3Ease of repair

If individual LED chips are used, then repair is difficult due to low yield, but using modules with shared electrodes improves yield and reduces repair difficulty

Engineering Contradiction:

ImproverepairabilityVSAvoidmodule structure

Core Design Contradiction:

Ease of repairVSDevice complexity

Solution Approach 1:

Multiple LED chips are merged into a module with shared electrodes, creating a self-contained unit that improves yield. The modular structure enhances repairability by allowing entire modules to be replaced or repositioned rather than individual chips, simplifying the repair process despite the increased internal structure complexity.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20220344312A1LED module, LED source substrate, display panel, and display apparatus

Publication Date: 2022.10.27 SHANGHAI TIANMA MICRO ELECTRONICS CO LTD

AI summary

An LED module, an LED source substrate, a display panel, and a display apparatus are provided. The LED module includes N LED chips. N is an integer not smaller than 2. The N LED chips share one first electrode. At least two of the N LED chips each include a second electrode.