Light Emitting Device Module Sliding Groove PCB Attachment

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Solution Overview

Problem

The existing connection methods for light emitting device packages to printed circuit boards require soldering, which is cumbersome and costly, and can damage the devices due to heat generation during the soldering process.

Innovation Solution

The light emitting device module incorporates sliding grooves and protrusions, as well as screw protrusions and grooves, allowing the package to be easily coupled and decoupled from the printed circuit board without the need for soldering, ensuring secure attachment and preventing damage from heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering is used to connect the light emitting device package to the printed circuit board, then the connection is secure and reliable, but the process becomes cumbersome, costly, and generates heat that can damage the device

Engineering Contradiction:
Improveconnection reliabilityVSAvoidmanufacturing ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the thermal soldering process with a mechanical connection system consisting of sliding grooves and protrusions. The light emitting device package includes sliding grooves that engage with sliding protrusions on the printed circuit board, creating a secure mechanical attachment without requiring heat or soldering materials.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The connection system is divided into separate components: sliding grooves formed in the light emitting device package and sliding protrusions formed on the printed circuit board. This segmentation allows each component to be manufactured independently and simplifies the assembly process, as the components can be easily engaged without complex soldering procedures.

Inventive Principle:
Principle #1Segmentation

2Reliability

If soldering is used to connect the light emitting device package to the printed circuit board, then the connection is secure, but heat is generated during the process that can damage or break the device

Engineering Contradiction:
Improveconnection reliabilityVSAvoidheat damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the thermal soldering process with a mechanical connection system consisting of sliding grooves and protrusions. The light emitting device package includes sliding grooves that engage with sliding protrusions on the printed circuit board, creating a secure mechanical attachment without requiring heat or soldering materials.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of operation

If a socket is used for connection between the light emitting device package and the printed circuit board, then the connection is easier, but the socket requires soldering for fixation which incurs additional costs

Engineering Contradiction:
Improveconnection easeVSAvoidmanufacturing cost
Core Design Contradiction:
Ease of operationVSEase of manufacture

Solution Approach 1:

The patent merges the connection functions into the basic structure of the light emitting device package itself. The sliding grooves are formed directly in the package body, eliminating the need for a separate socket component. This integration maintains ease of connection while removing the additional costs associated with socket manufacturing and soldering.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sliding groove structure serves multiple functions: it provides the connection interface, guides the insertion process, and secures the package to the board. This multi-functionality eliminates the need for separate socket components and reduces overall manufacturing complexity and cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Ease of operation

If the light emitting device package is to be easily detached from the printed circuit board, then the connection method must allow simple removal, but this may compromise the security and stability of the connection

Engineering Contradiction:
Improvedetachment easeVSAvoidconnection stability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent creates a dynamic connection system where the sliding grooves and protrusions allow the package to be easily inserted and removed along the sliding direction. The mechanical engagement provides stable connection during operation, while the sliding mechanism enables simple detachment when needed, balancing both connection reliability and ease of operation.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS9062857B2Light emitting device module
Publication Date: 2015.06.23 SUZHOU LEKIN SEMICON CO LTD
  • US9062857B2 patent drawing
  • US9062857B2 patent drawing
  • US9062857B2 patent drawing

AI summary

A light emitting device module is provided comprising a light emitting device package and a printed circuit board to which the light emitting device package is coupled, wherein the light emitting device package includes a sliding groove and a fixing groove, and wherein the printed circuit board includes a sliding protrusion coupled to the sliding groove to guide the light emitting device package to a predetermined position and a fixing protrusion coupled to the fixing groove at the predetermined position.