LED Module Thermal Management with Segmented Heat Sinks
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Solution Overview
Problem
Conventional LED heat management technologies are limited in effectively managing heat and light, particularly lacking in cooling for the sides and top of LED modules, leading to efficiency degradation and premature failure, and require improved integration for thermal management, mechanical support, and optical control.
Innovation Solution
The implementation of a light emitting diode (LED) module in thermal communication with both front and back heat sinks, utilizing key pins and key holes to ensure proper heat dissipation matching, along with a mounting and locking ring system for secure and efficient thermal management, mechanical support, and optical positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional flat surface heat sink attachment is used, then manufacturing simplicity is maintained, but heat dissipation effectiveness deteriorates due to insufficient contact surface area
Solution Approach 1:
The heat sink attachment system is segmented into multiple functional components: a mounting ring that provides circumferential contact, a locking ring that secures the LED module, and a flat surface interface. This segmentation allows each component to contribute to both manufacturing simplicity and enhanced heat dissipation through increased contact surface area between the LED module and heat sink.
2Device complexity
If LED modules are attached to flat heat sink surfaces, then device complexity is reduced, but thermal management performance deteriorates due to lack of cooling for sides and top
Solution Approach 1:
The mounting ring provides thermal contact in the circumferential dimension around the LED module, while the locking ring provides contact in the axial dimension. This multi-dimensional approach to thermal contact enables effective cooling of the sides and top of the LED module without significantly increasing device complexity, as the rings integrate multiple functions into compact structures.
3Reliability
If key pins and key holes are implemented, then thermal management matching is improved, but device complexity increases
Solution Approach 1:
The key pins and key holes are implemented as localized features at specific positions on the mounting and locking rings. These localized quality enhancements provide precise thermal management matching and mechanical alignment without requiring complex modifications throughout the entire structure. The key features are concentrated at critical interface points, minimizing overall device complexity while achieving reliable thermal and mechanical coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation, extends LED module lifespan, and provides a compact, cost-effective design for improved thermal management and optical control, addressing the limitations of conventional technologies.
Implementation Method 1
a back heat sink having heat dissipation properties and a thermally conductive face... the back of the LED module and face of the back heat sink are in thermal communication
Implementation Method 2
A mounting ring and locking ring can also be used to hold the LED module in place and in thermal communication with the back heat sink
Implementation Method 3
Key pins and key holes are used to prevent using a high power LED module with a back heat sink having insufficient heat dissipation capabilities
Data Source
AI summary
A light emitting diode (LED) module is in thermal communication with front and back heat sinks for dissipation of heat therefrom. The LED module is physically held in place with at least the back heat sink. A mounting ring and locking ring can also be used to hold the LED module in place and in thermal communication with the back heat sink. Key pins and key holes are used to prevent using a high power LED module with a back heat sink having insufficient heat dissipation capabilities required for the high power LED module. The key pins and key holes allow lower heat generating (power) LED modules to be used with higher heat dissipating heat sinks, but higher heat generating (power) LED modules cannot be used with lower heat dissipating heat sinks.