LED Module Waterproof Enclosure and Heat Sink Design

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Solution Overview

Problem

Existing LED lighting solutions face challenges in achieving effective waterproofness and heat dispersion due to the use of plastic enclosures with poor thermal conductivity, leading to aesthetic and performance issues.

Innovation Solution

An LED module with a waterproof enclosure made of silicone rubber and a heat sink exposed to the environment, coupled with a driver encapsulated through low-pressure molding, ensures both waterproofness and thermal conductivity, allowing for flexible formation of LED chains with improved aesthetics and performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If plastic enclosure is used to enclose the LED module, then waterproofness is improved, but heat dispersion deteriorates

Engineering Contradiction:
ImprovewaterproofnessVSAvoidheat dispersion
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The LED module is divided into two functional zones: an upper waterproof enclosure made of plastic for sealing and protection, and a lower heat dissipation structure made of metal for thermal management. This segmentation allows each part to perform its specialized function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The LED module employs a composite structure combining plastic material for the waterproof enclosure and metal material for the heat dissipation component. This composite design leverages the waterproof properties of plastic and the thermal conductivity of metal to simultaneously achieve both waterproofness and effective heat dispersion.

Inventive Principle:
Principle #40Composite materials

2Reliability

If epoxy resin or silicon resin is used for potting, then waterproofness is improved, but manufacturing complexity increases

Engineering Contradiction:
ImprovewaterproofnessVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the potting process (epoxy or silicon resin encapsulation) from the manufacturing workflow. Instead of using resin for both structural support and waterproofing, the design uses a dedicated waterproof enclosure structure, thereby simplifying the manufacturing process while maintaining IP65 waterproof rating.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

A waterproof seal structure acts as an intermediary between the LED module components and the external environment, providing reliable waterproof protection without requiring complex resin potting processes. This intermediary structure simplifies manufacturing while ensuring IP65 protection.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If plastic material is used for enclosure, then ease of manufacture is improved, but heat transmission deteriorates

Engineering Contradiction:
Improveease of manufactureVSAvoidheat transmission
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The enclosure is segmented into a plastic upper portion for ease of manufacturing and waterproofing, and a metal lower portion for heat transmission. This segmentation allows each material to be used where it provides the greatest benefit.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The LED module uses a composite construction with plastic material for the waterproof enclosure and metal material for the heat dissipation component, combining the manufacturing advantages of plastic with the thermal properties of metal.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a high level of waterproofness (IP65) and effective thermal management, enhancing the service life and light emitting performance of LED chains while maintaining a handsome finish surface.

Implementation Method 1

a radiating unit that is set in the bottom of the waterproof enclosure and exposed to the external environment

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a waterproof enclosure made of silicone rubber

Methodology Applied
Scientific EffectWaterproofing:

Data Source

PatentUS7994516B2LED module, and LED chain containing the same
Publication Date: 2011.08.09 OPTOTRONIC GMBH
  • US7994516B2 patent drawing
  • US7994516B2 patent drawing
  • US7994516B2 patent drawing

AI summary

The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding.