LED Module Waterproof Enclosure and Heat Sink Design
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Solution Overview
Problem
Existing LED lighting solutions face challenges in achieving effective waterproofness and heat dispersion due to the use of plastic enclosures with poor thermal conductivity, leading to aesthetic and performance issues.
Innovation Solution
An LED module with a waterproof enclosure made of silicone rubber and a heat sink exposed to the environment, coupled with a driver encapsulated through low-pressure molding, ensures both waterproofness and thermal conductivity, allowing for flexible formation of LED chains with improved aesthetics and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plastic enclosure is used to enclose the LED module, then waterproofness is improved, but heat dispersion deteriorates
Solution Approach 1:
The LED module is divided into two functional zones: an upper waterproof enclosure made of plastic for sealing and protection, and a lower heat dissipation structure made of metal for thermal management. This segmentation allows each part to perform its specialized function without compromising the other.
Solution Approach 2:
The LED module employs a composite structure combining plastic material for the waterproof enclosure and metal material for the heat dissipation component. This composite design leverages the waterproof properties of plastic and the thermal conductivity of metal to simultaneously achieve both waterproofness and effective heat dispersion.
2Reliability
If epoxy resin or silicon resin is used for potting, then waterproofness is improved, but manufacturing complexity increases
Solution Approach 1:
The invention extracts and eliminates the potting process (epoxy or silicon resin encapsulation) from the manufacturing workflow. Instead of using resin for both structural support and waterproofing, the design uses a dedicated waterproof enclosure structure, thereby simplifying the manufacturing process while maintaining IP65 waterproof rating.
Solution Approach 2:
A waterproof seal structure acts as an intermediary between the LED module components and the external environment, providing reliable waterproof protection without requiring complex resin potting processes. This intermediary structure simplifies manufacturing while ensuring IP65 protection.
3Ease of manufacture
If plastic material is used for enclosure, then ease of manufacture is improved, but heat transmission deteriorates
Solution Approach 1:
The enclosure is segmented into a plastic upper portion for ease of manufacturing and waterproofing, and a metal lower portion for heat transmission. This segmentation allows each material to be used where it provides the greatest benefit.
Solution Approach 2:
The LED module uses a composite construction with plastic material for the waterproof enclosure and metal material for the heat dissipation component, combining the manufacturing advantages of plastic with the thermal properties of metal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a high level of waterproofness (IP65) and effective thermal management, enhancing the service life and light emitting performance of LED chains while maintaining a handsome finish surface.
Implementation Method 1
a radiating unit that is set in the bottom of the waterproof enclosure and exposed to the external environment
Implementation Method 2
a waterproof enclosure made of silicone rubber
Data Source
AI summary
The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding.


