Light-Emitting Device Module Assembly for Yield
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Solution Overview
Problem
The implementation of local dimming technology in light-emitting devices requires a significant increase in the number of light-emitting diodes, leading to reduced production yield, which can be mitigated by assembling these devices from smaller light-emitting modules with fewer diodes, thereby improving production yield.
Innovation Solution
A light-emitting device is assembled by connecting multiple light-emitting modules through a conductive layer and an insulation layer, where each module has a substrate with cavities and sidewalls, allowing for efficient electrical and mechanical connection without increasing the number of diodes, enhancing the connection strength and luminous intensity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the number of light-emitting diodes is increased to implement local dimming technology, then the brightness/contrast of the display is improved, but the production yield is reduced
Solution Approach 1:
The light-emitting device is divided into multiple light-emitting modules, each containing a subset of the total light-emitting diodes. This segmentation allows each module to be manufactured and tested independently with fewer diodes, improving production yield, while the assembled device achieves the required brightness/contrast through coordinated operation of all modules.
2Productivity
If the light-emitting device is assembled from smaller light-emitting modules, then the production yield is improved, but the connection complexity between modules increases
Solution Approach 1:
A conductive layer is introduced as an intermediary component to facilitate electrical connections between multiple light-emitting modules. This conductive layer simplifies the connection process by providing a standardized interface, reducing the overall connection complexity despite the increased number of modules required for local dimming functionality.
3Productivity
If more light-emitting modules are assembled together, then the production yield is improved, but the connection strength between modules may be compromised
Solution Approach 1:
Multiple connection mechanisms are merged into a unified assembly structure, combining mechanical support, electrical connection, and structural stability into a single integrated system. This merging ensures that as more modules are assembled together, the overall connection strength is maintained through the cumulative effect of multiple bonded interfaces.
Data Source
AI summary
A light-emitting device includes a first light-emitting module, a second light-emitting module, a conductive layer and an insulation layer. The first light-emitting module includes a first substrate having a first cavity, a first sidewall, and a light-emitting component disposed on the first substrate. The second module includes a second substrate having a second cavity corresponding to the first cavity and a second sidewall corresponding to the first sidewall. The conductive layer is directly connected to the first cavity and the second cavity and electrically connect the first light-emitting module and the second light-emitting module. The insulation layer is directly connected to the first sidewall and the second sidewall.