Light Emitting Device Molded Cover Member Placement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process for downsized light emitting devices becomes increasingly complex due to the difficulty in forming or covering the lateral faces of light emitting elements with a housing or light reflecting member, necessitating a more efficient method for producing these devices.
Innovation Solution
A method involving the use of two molds to position and cover light emitting elements with cover members, where the elements are placed in recesses of the molds to allow for the formation of cover members on specific faces, enabling efficient manufacturing of downsized light emitting devices with improved light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the light emitting device is downsized, then the device size is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent combines multiple manufacturing operations into a single integrated mold system. The mold includes both a cavity for forming the light emitting element and a cover member formation region, allowing simultaneous formation of both components in one step, thereby reducing manufacturing process complexity while maintaining downsized device dimensions
Solution Approach 2:
The mold structure serves multiple functions: it acts as both the forming tool for the light emitting element and the cover member, and also defines the precise positioning features. This multi-functional design simplifies the overall manufacturing process by eliminating the need for separate tooling for different components
2Volume of moving object
If the light emitting device is downsized, then the device size is reduced, but it becomes more difficult to form a housing or cover the lateral faces with a light reflecting member
Solution Approach 1:
The housing and light reflecting member are merged into a single integrated component formed by the mold. The mold cavity and cover member formation region work together to create both the housing structure and the light reflecting surfaces in one manufacturing step, making the process easier despite the downsized dimensions
Solution Approach 2:
The patent employs thin film or shell-like cover members that can be formed directly by the mold. These thin structures are sufficient to cover the lateral faces of the downsized light emitting element and provide the necessary light reflecting function without requiring bulky housing structures
Data Source
AI summary
A method of manufacturing a light emitting device includes placing a light emitting element in a first recess; covering with a first cover member the second to fourth element lateral faces of the light emitting element exposed in the first recess; extracting from the first recess the light emitting element equipped with the first cover member; placing the light emitting element in the second recess by bringing the first element lateral face of the light emitting element extracted from the first recess into contact with the second recess first inner lateral face of the second recess and spacing the substrate face of the light emitting element apart from the second recess bottom face of the second recess; covering the substrate face with a second cover member in the second recess; and extracting from the second recess the light emitting element equipped with the second cover member formed thereon.