LED Molding Layer Structure for Thermal Stability and Light Extraction

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Solution Overview

Problem

Light emitting diodes (LEDs) face issues with stability and reliability due to thermal impact from external environments, leading to cracks and reduced thermal stability, and there is a need for improved light extraction efficiency and reduced color deviation.

Innovation Solution

A light emitting apparatus with a substrate, a first molding layer covering the light emitting device, and a second molding layer surrounding the substrate with higher hardness than the first, along with a film layer and coating layer to enhance thermal stability and reliability, while improving light extraction efficiency and reducing color deviation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single molding layer is used to cover the light emitting device, then the structure is simple, but the thermal stability and reliability are insufficient under thermal impact from external environment

Engineering Contradiction:

Improvethermal stabilityVSAvoidmolding layer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The molding layer is divided into two distinct layers: a first molding layer covering the light emitting device and a second molding layer surrounding the outer periphery of the substrate. This segmentation allows each layer to be optimized for different functions - the first layer for light extraction and the second layer for thermal stress resistance - thereby improving overall reliability without excessive complexity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the molding structure are assigned different hardness properties. The second molding layer surrounding the substrate periphery is made harder to resist thermal impact and external stress, while the first molding layer covering the light emitting device maintains appropriate softness for light extraction. This local differentiation of material properties enhances thermal stability while maintaining functional performance

Inventive Principle:

Principle #3Local quality

2Reliability

If the molding layer has high hardness to resist thermal impact, then the thermal stability improves, but the light extraction efficiency decreases

Engineering Contradiction:

Improveresistance to thermal impactVSAvoidlight extraction efficiency

Core Design Contradiction:

ReliabilityVSIllumination intensity

Solution Approach 1:

The molding structure is segmented into two layers with different hardness characteristics. The first molding layer covering the light emitting device is softer to maintain light extraction efficiency, while the second molding layer surrounding the substrate is harder to provide thermal impact resistance. This segmentation resolves the contradiction by assigning different mechanical properties to different functional regions

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The hardness property is locally optimized for each molding layer based on its specific function. The first layer has lower hardness to facilitate light extraction, while the second layer has higher hardness to resist thermal impact. This local quality differentiation allows simultaneous achievement of both light extraction efficiency and thermal stability

Inventive Principle:

Principle #3Local quality

3Illumination intensity

If the molding layer has low hardness to maintain light extraction efficiency, then the luminance improves, but the resistance to thermal stress and external impact decreases

Engineering Contradiction:

ImproveluminanceVSAvoidresistance to thermal stress

Core Design Contradiction:

Illumination intensityVSStrength

Solution Approach 1:

The molding layer is segmented into two distinct layers with different mechanical properties. The first molding layer has lower hardness to maintain light extraction efficiency and luminance, while the second molding layer has higher hardness to provide strength against thermal stress and external impact. This segmentation allows each layer to optimize its performance for its specific function

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different hardness properties are assigned to different molding layers based on their local functional requirements. The first layer covering the light emitting device has softer material for optimal light extraction, while the second layer surrounding the substrate has harder material for stress resistance. This local quality optimization resolves the contradiction between luminance and strength

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250234693A1Light emitting apparatus and light emitting module comprising the same

Publication Date: 2025.07.17 SEOUL SEMICONDUCTOR

AI summary

A light emitting apparatus and a light emitting module including the same, and, more particularly, a light emitting apparatus including a light emitting device and a molding layer covering the light emitting device, and a light emitting module including the same. The light emitting apparatus includes a substrate, at least one light emitting device disposed on a surface of the substrate, a first molding layer covering at least a region of the light emitting devices, and a second molding layer surrounding an outer periphery of the substrate.