LED Mount Substrate with Insulated Semiconductor Bodies
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Solution Overview
Problem
Conventional LED devices face issues with mechanical strength and reliability due to the use of silicon oxide layers, which can lead to separation and reduced reliability, and increased manufacturing costs when using high-resistance silicon substrates or forming ESD protection elements in semiconductor substrates.
Innovation Solution
A light-emitting-element mount substrate with a low-resistance semiconductor substrate divided by an insulating layer into multiple insulated bodies, featuring surface and external connection electrodes, and an electrostatic-destruction prevention layer, which enhances mechanical strength and simplifies manufacturing by eliminating the need for via electrodes and reducing ESD protection complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon oxide layer is used for insulation in the substrate, then electrical insulation is achieved, but mechanical strength decreases and separation occurs
Solution Approach 1:
The patent uses a composite structure combining semiconductor substrate material with metal insulation layers (such as aluminum or copper) instead of silicon oxide. This composite approach maintains electrical insulation while improving mechanical strength and preventing separation issues associated with silicon oxide layers.
2Reliability
If high-resistance silicon substrates are used, then ESD protection is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the ESD protection function from the substrate material itself and implements it through a separate electrostatic-destruction prevention layer. This allows using standard low-resistance silicon substrates while still providing ESD protection through the dedicated layer, thereby reducing manufacturing costs.
Solution Approach 2:
The patent introduces an intermediary electrostatic-destruction prevention layer between the semiconductor substrate and the external environment. This layer acts as a mediator that provides ESD protection without requiring the substrate itself to have high resistance, thus avoiding the cost penalty of using high-resistance substrates.
3Reliability
If via electrodes are formed to connect electrodes, then electrical connection is achieved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the electrical connection function with the substrate structure itself by using the semiconductor substrate as the connection medium. The substrate directly electrically connects the electrodes on its front surface to the external connection electrodes on its back surface, eliminating the need for separate via electrodes and reducing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable LED device with improved mechanical strength, efficient heat release, and simplified manufacturing, while preventing electrostatic destruction and reducing the risk of short circuits, thereby increasing the lifespan and reliability of the LED device.
Implementation Method 1
heat generated by the light emitting element has to be efficiently released to an external circuit board
Implementation Method 2
an insulating layer that divides the substrate body into a first semiconductor substrate body, a second semiconductor substrate body, and a third semiconductor substrate body, which are insulated from one another
Implementation Method 3
electrostatic-destruction prevention layer, which enhances mechanical strength and simplifies manufacturing by eliminating the need for via electrodes and reducing ESD protection complexity
Data Source
AI summary
A light-emitting-element mount substrate formed by relatively simple manufacturing steps, having a good heat release property, and having a high mechanical strength; and an LED device including the light-emitting-element mount substrate are provided. A substrate body of a light-emitting-element mount substrate is made of a low-resistance semiconductor (e.g., n-type silicon) substrate, and is divided into a first and second individual substrate bodies by an insulating layer. A first front-surface mounting electrode and a first external-connection electrode are formed on respective first and second major surfaces (e.g., front and back surfaces) of the first individual substrate body. A second front-surface mounting electrode and a second external-connection electrode are formed respective first and second major surfaces (e.g., front and back surfaces) of the second individual substrate body. The insulating layer has a shape different from a straight-line shape in plan view.