LED Mounting Board with Pass-Through Holes for Visual Inspection
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Solution Overview
Problem
Conventional mounting boards for electronic components, such as light-emitting diodes, make it difficult to visually check the condition of solder or connection portions from the upper surface, requiring inversion or X-ray inspection, and are costly due to the need for patterned electrodes on metal substrates.
Innovation Solution
A mounting board design with pass-through holes that allow patterned electrodes to extend from the upper to the lower surface, enabling visual inspection of solder connections within the holes and accommodating electronic components with metal bases by splitting electrodes into independent patterns using penetrating grooves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the light-emitting diode is mounted by inserting the light-emitting area into the pass-through hole and soldering the electrodes to the lower surface of the mounting board, then the overall thickness is reduced, but the solder fillet cannot be visually checked from above the upper surface
Solution Approach 1:
The mounting board is divided into multiple layers including a front surface board and a rear surface board, with the pass-through hole penetrating through both. The soldering occurs at the front surface while the light-emitting area extends through to the rear surface, enabling visual inspection of solder joints from the front while maintaining reduced overall thickness.
Solution Approach 2:
The design transitions from a single-layer mounting board to a multi-layer structure where the pass-through hole creates a three-dimensional pathway. The light-emitting area and electrodes are positioned at different depths and surfaces, allowing inspection from the front surface dimension while the component extends to the rear surface dimension.
2Reliability
If patterned electrodes are provided on a metal base substrate to enable soldering, then reliable electrical connection is achieved, but the manufacturing cost increases due to the complexity of providing electrodes on metal substrates
Solution Approach 1:
The mounting board is segmented into a front surface board with patterned electrodes for soldering and a rear surface board with the light-emitting area. This segmentation allows the use of cost-effective electrode formation methods on the front surface while maintaining reliable electrical connections, avoiding the need for complex electrode structures on metal bases.
Solution Approach 2:
The front surface board acts as an intermediary between the external circuit and the light-emitting diode. It provides the patterned electrodes for reliable soldering and electrical connection, while the rear surface board accommodates the light-emitting area, separating the expensive metal base requirements from the electrode formation process.
Data Source
AI summary
A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.