Light-Emitting Element Mounting with Positional Deviation Correction
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Solution Overview
Problem
The challenge in mounting light-emitting elements on a board by soldering lies in achieving high positioning accuracy due to variations in the reference position of the light-emitting elements and self-alignment issues during the soldering process, which makes it difficult to ensure precise alignment of the emission portion with the mounting position.
Innovation Solution
An electronic component mounting system and method that includes a solder paste supply unit, adhesive applying unit, emission portion detecting unit, light-emitting element position detecting unit, light-emitting element positioning unit, light-emitting element mounting unit, and reflow unit, which together enable precise positioning and fixation of light-emitting elements on the board by detecting positional deviations and using an absorption nozzle to align the emission portion with the prescribed position before soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If soldering process is used to mount light-emitting elements on a board, then manufacturing cost and power consumption are reduced, but positioning accuracy deteriorates due to self-alignment action and reference position variation
Solution Approach 1:
The patent applies preliminary action by detecting the position of light-emitting elements and calculating correction values before the soldering process. The system measures the actual positions of light-emitting elements and their emission portions, calculates positional deviations, and determines correction values in advance. This allows the mounting positions to be adjusted before soldering occurs, preventing the self-alignment action from causing positioning errors while maintaining the cost-effective soldering process.
2Ease of manufacture
If soldering process is used to mount light-emitting elements on a board, then manufacturing cost and power consumption are reduced, but positioning accuracy deteriorates due to reference position variation
Solution Approach 1:
The patent implements feedback by measuring the actual positions of light-emitting elements and their emission portions, comparing these measurements with target positions, and using the detected deviations to calculate correction values. The system continuously monitors positioning accuracy and adjusts mounting positions based on feedback from position detection, thereby compensating for reference position variations and maintaining high positioning accuracy throughout the manufacturing process.
3Reliability
If self-alignment action occurs during soldering, then bonding is achieved, but positioning accuracy deteriorates as bonding position deviates from mounting position
Solution Approach 1:
The patent applies preliminary anti-action by counteracting the self-alignment effect before it occurs. The system detects the positions of light-emitting elements and calculates correction values that compensate for the expected self-alignment deviation during soldering. By adjusting the mounting positions in advance based on detected positional deviations, the system prevents the bonding position from deviating from the mounting position, thereby maintaining positioning accuracy while preserving bonding reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the accurate placement and soldering of light-emitting elements on a board, ensuring high positioning accuracy and preventing self-alignment issues during the soldering process, thereby improving the manufacturing efficiency of illumination boards.
Implementation Method 1
an image of a back surface of the light-emitting element which is obtained in a state in which the top surface of the light-emitting element is absorbed and held by an absorption nozzle of an electronic component mounting machine
Implementation Method 2
an adhesive curing unit which cures the adhesive and which fixes the light-emitting element to the board
Implementation Method 3
a reflow unit which melts solder in the solder paste in a state in which the light-emitting element is fixed to the board by the cured adhesive and which connects the terminals of the light-emitting elements to the respective lands of the board electrically and mechanically
Data Source
AI summary
In an electronic component mounting method, a light-emitting element is temporarily fixed to a board by solder paste and adhesive, the adhesive is cured to fix a main body of the light-emitting element to the board, and solder is melted to bond a terminal of the light-emitting element to the board. The method includes: detecting a positional deviation of an emission portion in a top surface of the light-emitting element; detecting a position of the light-emitting element in a state in which the light-emitting element is held by an absorption nozzle; positioning the emission portion to a prescribed position on the board based on the positional deviation and the position of the light-emitting element; mounting the light-emitting element on the board at a position deviated from the prescribed position by the positional deviation; curing the adhesive; and heating the board to melt the solder.