LED Mounting Assembly Metal Layers Thermal Dissipation
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Solution Overview
Problem
Existing mounting assemblies for light emitting diodes face challenges in reducing feature size while maintaining effective power dissipation, often increasing technical effort and costs due to the need for smaller sizes and improved thermal management.
Innovation Solution
A mounting assembly utilizing metal layers with electrical and thermal contacts on the backside of the LED, connected to a heat sink, allowing for efficient power dissipation through the metal layers and a mounting board, thereby reducing the feature size and technical effort.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the feature size of light emitting diodes is reduced to increase light emission, then the light emission is improved, but the power density increases and more heat is dissipated
Solution Approach 1:
The patent combines the electrical contact function and thermal management function into a single integrated structure. The mounting assembly uses metal layers that simultaneously serve as electrical contacts for power supply and as thermal pathways for heat dissipation, eliminating the need for separate wire bonding for power supply and separate thermal management structures.
Solution Approach 2:
The metal layers in the mounting assembly perform multiple functions: they provide electrical connection for power supply to the LED, serve as thermal conduction pathways for heat dissipation, and provide mechanical support. This multi-functional design allows the structure to handle both the increased power density and heat dissipation requirements of miniaturized LEDs.
2Reliability
If wire bonding is used to connect the LED to the lead frame, then electrical connection is achieved, but the technical effort is increased and the light emitting surface size is reduced
Solution Approach 1:
The patent merges the electrical connection function and thermal management function into a single integrated structure. The mounting assembly uses metal layers that simultaneously serve as electrical contacts for power supply and as thermal pathways for heat dissipation, eliminating the need for separate wire bonding for power supply and separate thermal management structures.
Solution Approach 2:
The patent extracts the power supply connection function from the wire bonding process and integrates it directly into the mounting assembly structure. The metal layers are directly connected to the LED contact pads, eliminating the need for separate wire bonding operations for electrical connection.
3Temperature
If ceramics are used for packages and substrates to improve power dissipation, then the power dissipation properties are improved, but the technical effort and costs increase
Solution Approach 1:
The patent changes the material parameter from ceramics to metal layers, which have high thermal conductivity. The metal layers provide effective heat dissipation pathways while being easier to manufacture and integrate into the mounting assembly, reducing both technical effort and costs compared to ceramic-based solutions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved power dissipation with reduced technical effort and smaller feature sizes, as the electrical contacts on the backside serve as thermal contacts, dissipating heat effectively to the mounting board, maintaining electrical performance while minimizing the LED's dimensions.
Implementation Method 1
the power generated in the electrical device can be easily dissipated via the electrical and thermal contacts into the metal layer and further dissipated via the bottom contacts to the mounting board
Implementation Method 2
The mounting board forms a heat sink for the electrical device. Hence, the electrical power of the electrical device can be dissipated with low technical effort
Data Source
Figure 1
Figure 2
Figure 3a~3b
AI summary
A mounting assembly (10) is disclosed for mounting and connecting an electrical device, in particular a light emitting diode. The mounting assembly (10) comprises a mounting element (12) including at least two metal layers (14, 16) each having a top surface (24) and a bottom surface (28). Top contact pads are formed at the top surface of each of the metal layers for providing a planar electrical and thermal contact to the electrical device. Bottom contact pads are formed at the bottom surface of each of the metal layers for providing a planar electrical and thermal contact to a mounting board (34).