Light Emitting Device Mounting with Recessed Substrate and Projecting Package
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Solution Overview
Problem
Existing light emitting device mounting structures on wiring substrates face challenges in increasing the light emitting region while ensuring efficient light incidence onto a light guide member, often resulting in obstructed light emission due to the substrate's configuration.
Innovation Solution
A light emitting device mounting structural body with a wiring substrate featuring a recess and a resin molded body with a projecting portion that houses the light emitting element, allowing for expanded light emission without reducing mounting stability, and incorporating a light-reflecting member to enhance light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the light emitting device is mounted on a wiring substrate with a recess, then the light emitting region can be expanded, but the light incidence onto the light guide member may be obstructed
Solution Approach 1:
The patent transitions from a planar mounting structure to a three-dimensional structure by forming a recess in the wiring substrate and creating a projecting portion that extends into the recess. This dimensional change allows the light emitting element to be positioned at multiple height levels, enabling both expanded light emitting area and unobstructed light incidence onto the light guide member.
Solution Approach 2:
The projecting portion of the resin molded body is nested within the recess of the wiring substrate, creating a layered configuration where the light emitting element is housed within the substrate structure. This nesting arrangement allows the light emitting region to expand while maintaining proper light path alignment with the light guide member.
2Area of moving object
If the lower portion of the package body is projected downward to increase light emitting region, then the light emitting area increases, but the mounting stability may be compromised
Solution Approach 1:
The projecting portion extending downward from the package body is nested within the recess of the wiring substrate. This nesting configuration provides mechanical support and anchoring for the light emitting device, ensuring mounting stability while allowing the light emitting region to expand downward into the recess space.
Solution Approach 2:
The resin molded body is designed with different structural characteristics in different regions: the main package body maintains its sealing and protective function, while the projecting portion is specifically designed for mechanical interlocking with the recess. This local differentiation of structural quality enables both expanded light emitting area and secure mounting.
3Illumination intensity
If a light-reflecting member is added to enhance light extraction, then the luminance improves, but the device complexity increases
Solution Approach 1:
The light-reflecting member is integrated with the wiring substrate, forming a combined structure where the reflecting surface is positioned at the bottom of the recess. This merging of the reflecting function into the substrate structure enhances light extraction efficiency and luminance while avoiding the complexity of a separate, standalone reflecting component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the light emitting region and improves luminance by ensuring efficient light incidence onto the light guide member, enhancing the brightness and color reproduction range of the lighting device.
Implementation Method 1
a light emitting element 8 is mounted on an inner lead 6b
Implementation Method 2
incorporating a light-reflecting member to enhance light extraction
Data Source
AI summary
A light emitting device mounting structural body includes a wiring substrate having wirings disposed on a base member and a light emitting device having a resin molded body mounted on the wiring substrate. The wiring substrate has a recess in its periphery. The resin molded body has a lower surface and a side surface. The lower surface has an arrangement portion and a projecting portion, the arrangement portion has an outer lead electrically connected to the wiring portion disposed beneath the arrangement portion, and the projecting portion is projected further downward relative to the arrangement portion. The side surface has an opening with a light emitting element mounted thereon, the opening is expanded in the projecting portion, and at least a portion of the opening is housed in the recess of the wiring substrate.