Light-Emitting Device Optical Element Segmentation and Carrier Integration
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Solution Overview
Problem
Conventional light-emitting devices face challenges in achieving efficient light extraction and heat dissipation due to the limitations of miniature packaging designs, particularly in Chip-Level Packages (CLPs), which affect their performance and efficiency.
Innovation Solution
The manufacturing method involves forming multiple optical elements and conductive structures within a light-emitting device, using carriers made of materials like Diamond Like Carbon (DLC) and transparent polymers, to enhance light extraction and heat dissipation, including a wavelength-converting layer and reflective layers to optimize light emission and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If miniature packaging design (Chip-Level Package) is used to reduce device size, then the device becomes smaller and more suitable for modern electronic products, but light extraction efficiency and heat dissipation performance deteriorate
Solution Approach 1:
The patent divides the optical element into multiple segments including a light-emitting element, a first optical element, a second optical element, and a wavelength-converting layer. Each segment performs a specific function: the first optical element extracts light, the wavelength-converting layer converts wavelength, and the second optical element reflects light. This segmentation allows the compact CLP design to maintain high light extraction efficiency by optimizing each component's function within the limited space.
Solution Approach 2:
The patent implements a nested structure where the light-emitting element is positioned within an opening of the first optical element, the wavelength-converting layer is formed on the light-emitting element, and the second optical element is formed on the wavelength-converting layer. This nesting approach maximizes the use of vertical space in the miniature package while maintaining efficient light extraction and wavelength conversion functions.
2Volume of moving object
If miniature packaging design (Chip-Level Package) is used to reduce device size, then the device becomes smaller and more suitable for modern electronic products, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a carrier as an intermediary substrate that supports the optical elements and provides a thermal management interface. The carrier is configured to be bonded to a circuit board, which serves as a heat sink. This intermediary structure enables efficient heat transfer from the light-emitting element through the optical elements and carrier to the circuit board, maintaining effective heat dissipation in the miniature package design.
3Reliability
If multiple optical elements and layers are added to improve light extraction, then light extraction efficiency improves, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into an integrated structure where the first optical element, wavelength-converting layer, and second optical element are formed in a stacked configuration on a single carrier. The light-emitting element is positioned within an opening of the first optical element, creating a compact integrated assembly. This merging approach maintains high light extraction efficiency while reducing overall structural complexity compared to separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves light extraction efficiency and heat dissipation, enabling more effective performance in miniature light-emitting devices, such as LEDs and OLEDs, by guiding and reflecting light while managing heat effectively.
Implementation Method 1
a wavelength-converting layer 26 formed on the light-emitting element 24
Implementation Method 2
including a wavelength-converting layer and reflective layers to optimize light emission
Data Source
AI summary
A method of manufacturing a light-emitting device includes forming a first optical element on a first carrier, wherein the first optical element comprises an opening; forming a light-emitting element in the opening; forming a second optical element on the light-emitting element; forming a second carrier on the first optical element and the second optical element; removing the first carrier after forming the second carrier on the first optical element and the second optical element; and forming two separated conductive structures under the first optical element.