In-Place Optical Testing of LED Components via Segmented Probe Arrays
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Solution Overview
Problem
Existing electronic component testing methods require separating components from a wafer substrate for optical testing, which is a time-consuming and labor-intensive process.
Innovation Solution
An electronic component measuring equipment with a first and second mounting platform, an actuating device, a current output module, a switching device, and an optical measuring component, allowing probe pairs on the first platform to contact under-test components on the second platform, forming conducting loops to generate light signals for optical testing without separating the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electronic components are separated from wafer substrate for optical testing, then measurement precision is improved, but loss of time increases and productivity decreases
Solution Approach 1:
The probe substrate is divided into multiple probe pairs, each independently contacting a corresponding electronic component on the testing substrate. This segmentation allows simultaneous testing of multiple components while maintaining the components in their original arrayed positions on the wafer substrate, thus achieving precise optical testing without time-consuming separation.
Solution Approach 2:
The testing system transitions from a sequential single-component testing approach to a parallel multi-component testing approach by utilizing the spatial arrangement of probe pairs in the array. This dimensional change allows all components to be tested simultaneously in their original positions, eliminating the need for physical separation and significantly reducing testing time while maintaining measurement precision.
2Measurement precision
If electronic components are separated from wafer substrate for optical testing, then measurement precision is improved, but productivity decreases
Solution Approach 1:
The probe substrate is divided into multiple probe pairs, each independently contacting a corresponding electronic component on the testing substrate. This segmentation allows simultaneous testing of multiple components while maintaining the components in their original arrayed positions on the wafer substrate, thus achieving precise optical testing without time-consuming separation.
Solution Approach 2:
The testing process maintains continuity by keeping electronic components in their original positions on the wafer substrate and using probe pairs to establish continuous electrical and optical contact. This eliminates the disruptive separation step, allowing continuous parallel testing of all components, thereby improving productivity while maintaining measurement precision.
3Productivity
If probe pairs contact under-test electronic components to form conducting loops, then productivity is improved through parallel testing, but device complexity increases
Solution Approach 1:
The probe pairs serve multiple functions: they provide electrical contact for current input, form conducting loops for light signal generation, and enable optical measurement. This multi-functionality reduces the need for separate dedicated components for each function, thereby improving productivity through parallel testing while limiting the increase in device complexity.
Solution Approach 2:
The system merges the current input function, light signal generation function, and optical measurement function into a single integrated testing structure where probe pairs contact electronic components to form conducting loops. This merging allows parallel testing of multiple components simultaneously, improving productivity while keeping the overall device structure relatively simple and unified.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient optical testing of electronic components in place, distinguishing satisfactory from unsatisfactory components through luminescence, brightness, and wavelength analysis, reducing testing time and improving efficiency.
Implementation Method 1
Conducting loops are formed between the at least partial of probe pairs and the at least partial of under-test electronic components in contact with the probe pairs, such that the under-test electronic components generate light signals through the conducting loops
Data Source
AI summary
An electronic component measuring equipment includes a first mounting platform, a second mounting platform, an actuating device, a current output module, a switching device and an optical measuring component. Multiple probe pairs are disposed on a probe substrate mounted on the first mounting platform. Multiple under-test electronic components are disposed on a testing substrate mounted on the second mounting platform. The actuating device is configured to make at least partial of the probe pairs on the probe substrate in contact with at least partial of under-test electronic components. The current output module provides a constant current to the probe substrate, and conducting loops are formed between the probe pairs and the under-test electronic components in contact therewith. The switching device switches the constant current to each probe pairs. The optical measuring component measures light signals generated by the under-test electronic components.