LED Illumination Device Integrated Output Window Thermal Management
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Solution Overview
Problem
LED illumination devices using wavelength converting materials face heat-related issues that degrade color conversion performance and alter the color point of light over time, necessitating improved thermal management solutions.
Innovation Solution
An LED-based illumination device with an integrated output window sub-assembly and a thermally conductive ring, where the thermally conductive ring has a radial width equal to or greater than the output window's thickness, and a curable, thermally conductive bonding material is used to enhance heat dissipation between the output window and the thermal frame, coupled with a thermally conductive ring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If wavelength converting materials are used in LED illumination devices to generate desired color points, then color conversion performance is improved, but heat generation increases which degrades the wavelength converting materials over time and alters the color point
Solution Approach 1:
The patent segments the thermal management function by introducing a dedicated thermally conductive ring structure that is integrated with the output window. This ring acts as a separate thermal pathway, conducting heat away from the wavelength converting materials at the output window perimeter, thereby addressing the heat generation issue while preserving color conversion performance.
Solution Approach 2:
The patent introduces a curable thermally conductive bonding material as an intermediary between the output window and the thermal frame. This bonding material serves as a thermal conduit, transferring heat from the output window through the thermally conductive ring to the thermal frame, effectively mediating the heat transfer path and reducing temperature at critical locations.
2Reliability
If traditional separate components are used for output window and thermal management, then manufacturing is simpler, but thermal management effectiveness is reduced leading to color point degradation over time
Solution Approach 1:
The patent merges the output window and thermal management functions into a single integrated output window sub-assembly. The thermally conductive ring is integrated with the output window, and the curable thermally conductive bonding material bonds this integrated structure to the thermal frame, creating a unified component that simultaneously provides optical output and thermal management, thereby improving reliability without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages heat generated by wavelength converting materials, maintaining color conversion performance and stability of the color point over time, ensuring consistent light output.
Implementation Method 1
a curable, thermally conductive bonding material is disposed between the output window and the thermally conductive ring
Implementation Method 2
a thermally conductive ring coupled to the perimeter surface of the output window
Data Source
AI summary
An LED based illumination device includes LEDs mounted to an LED mounting board, an integrated output window sub-assembly, and a thermal frame coupled between the integrated output window sub-assembly and the LED mounting board. The integrated output window sub-assembly may include an output window and a thermally conductive ring coupled to the perimeter surface of the output window. The thermally conductive ring may have a radial width equal to or greater than the thickness of the output window. Additionally, the output window and the thermally conductive ring may have coplanar top and bottom surfaces. The thermally conductive ring surrounding the perimeter of the output window may include one or more pockets into which a curable, thermally conductive bonding material is disposed in an uncured state and flows into a gap between the perimeter of the output window and the thermally conductive ring.