LED Sealing Overcoat Structure for Clean Release and Stable Dicing
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Solution Overview
Problem
Existing semiconductor light emitting devices face challenges in easy removal from packaging due to adhesive sealing resins, leading to difficulties in handling and dicing processes, where the lack of an overcoat layer results in adhesion issues with packaging materials and reduced dicing accuracy.
Innovation Solution
Incorporating an inorganic overcoat layer made of SiO2, which is non-adhesive and uniformly thick, covering the sealing member to prevent adhesion with packaging materials and allowing for stable dicing processes, while also reducing manufacturing costs by eliminating the need for additional surface treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive sealing resin is used to seal the semiconductor light emitting element, then the sealing and protection of the element is improved, but the removal from packaging and handling becomes difficult
Solution Approach 1:
The patent divides the sealing structure into two distinct functional layers: an adhesive sealing resin layer for bonding and protection, and a non-adhesive overcoat layer for preventing unwanted adhesion. This segmentation allows each layer to perform its specific function without interference, resolving the contradiction between needing adhesion for sealing and non-adhesion for easy removal.
Solution Approach 2:
The patent applies different material properties to different regions of the sealing structure. The sealing resin layer has adhesive properties for bonding, while the overcoat layer has non-adhesive properties for easy removal. This local differentiation of material qualities allows the same component to exhibit both adhesive and non-adhesive characteristics in different areas, resolving the contradiction.
2Ease of manufacture
If no overcoat layer is applied on the sealing member, then the manufacturing process is simpler, but adhesion issues with packaging materials and dicing accuracy are reduced
Solution Approach 1:
The patent adds a dedicated overcoat layer as a separate functional component that specifically addresses dicing accuracy and packaging adhesion issues without complicating the core sealing process. This segmentation allows the manufacturing process to remain simple while adding only the necessary protective function.
Solution Approach 2:
The patent uses a composite structure combining the adhesive sealing resin with a non-adhesive overcoat material (such as SiO2). This composite material system provides both the bonding functionality of the sealing resin and the non-adhesive, high-precision properties of the overcoat layer, resolving the contradiction between manufacturing simplicity and precision.
3Manufacturing precision
If an overcoat layer is added to cover the sealing member, then dicing accuracy and packaging removal ease are improved, but the device structure becomes more complex
Solution Approach 1:
The overcoat layer is applied only where needed - specifically on the upper surface of the sealing member that contacts packaging materials and the sides that contact the dicing blade. This localized application provides the necessary precision and non-adhesive properties without unnecessarily complicating the entire device structure.
Solution Approach 2:
The overcoat layer is implemented as a thin film coating (such as SiO2) that provides the necessary functional properties with minimal added complexity. This thin film approach maintains structural simplicity while delivering the precision and non-adhesive characteristics needed for improved dicing and packaging removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The overcoat layer ensures easy extraction of semiconductor light emitting devices from packages and improves dicing accuracy and stability, while maintaining light quality and reducing manufacturing time and costs.
Implementation Method 1
an inorganic overcoat layer made of SiO2, which is non-adhesive and uniformly thick, covering the sealing member to prevent adhesion with packaging materials
Data Source
AI summary
A semiconductor light emitting device includes: a semiconductor light emitting element; a sealing member that seals the semiconductor light emitting element; and an overcoat layer that covers the sealing member, wherein the sealing member includes a sealing resin and has a first upper surface on an opposite side to the semiconductor light emitting element, and wherein the overcoat layer is formed of an inorganic material and is in direct contact with the first upper surface of the sealing member.