LED Package Active Control for High-Resolution Displays
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Solution Overview
Problem
Conventional LED display technologies face challenges in achieving high resolution and efficiency due to the complexity and cost associated with densely populated driver electronics, particularly as pixel pitches decrease, leading to thermal crowding and increased complexity.
Innovation Solution
The implementation of active electrical elements within LED packages that can receive and process control signals to maintain operating states such as brightness or color select signals for LED chips, reducing the need for extensive external driver electronics by incorporating memory, signal conditioning, and thermal management devices, enabling active matrix addressing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pixel pitch is decreased to achieve higher resolution, then image resolution is improved, but device complexity and thermal crowding increase due to densely populated driver electronics
Solution Approach 1:
The driver electronics are segmented and distributed into individual LED packages rather than being concentrated on a separate driver board. Each LED package contains its own active electrical element (memory device and driver circuitry), dividing the centralized control function into distributed autonomous units that can operate independently
Solution Approach 2:
The driver electronics are nested within the LED package structure itself. The active electrical element including memory device and driver circuitry is integrated inside each LED package, with the memory device electrically connected to the LED chip through conductive traces on the same substrate, creating a nested configuration where control functionality is embedded within the light-emitting unit
2Manufacturing precision
If driver electronics are densely populated to control more pixels, then image resolution is improved, but thermal crowding increases due to closely spaced electrical devices
Solution Approach 1:
The thermal management function is segmented and distributed to each individual LED package through integrated thermal management devices. Each package independently manages its own thermal load rather than sharing a centralized thermal management system, preventing thermal accumulation in densely populated areas
Solution Approach 2:
Thermal management devices act as intermediary components between the LED chip and the external environment. These devices (such as heat sinks or thermally conductive materials) are integrated within each LED package to facilitate heat dissipation from the LED chip and active electrical element, serving as a thermal interface that prevents heat buildup
3Device complexity
If external driver electronics are reduced, then device complexity is decreased, but control capability over LED pixels must be maintained through alternative means
Solution Approach 1:
Each LED package is made self-sufficient with integrated active electrical elements that include memory devices for storing control signals and driver circuitry for generating drive signals. The LED package autonomously maintains its operating state (brightness, color) using its own internal resources without requiring continuous external control signals or complex external driver electronics
Solution Approach 2:
The active electrical element performs multiple functions within a single integrated component: it receives control signals, stores them in memory, processes them through signal conditioning, generates appropriate drive signals for the LED chip, and manages thermal conditions. This multi-functional integration replaces the need for separate external driver electronics while maintaining full control capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reduced pulsing or continuous drive signals for LED pixels, decreasing complexity and cost while maintaining high resolution and efficiency, and enabling the use of fewer external electrical devices.
Implementation Method 1
signal conditioning...devices
Implementation Method 2
When a bias is applied across the doped layers, holes and electrons are injected into the one or more active layers where they recombine to generate emissions such as visible light or ultraviolet emissions
Implementation Method 3
thermal management devices
Data Source
AI summary
Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. The control signal may be provided in a data stream that includes a plurality of data packets. Each data packet may include an identifier that enables each LED package of an array that receives the data packet to take one or more actions based on the identifier or a series of identifiers.