Light-Emitting Package With Non-Uniform Adhesive Layer
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Solution Overview
Problem
Light-emitting diode displays face issues such as uneven illumination, electrical controlling difficulties, size limitations, and high manufacturing costs, which need to be effectively addressed.
Innovation Solution
A light-emitting package structure comprising a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip, where the adhesive layer has a first and second portion with the second portion's thickness being smaller than or equal to the first portion, and a method of manufacturing involving heating the adhesive material to a semi-solid colloidal state to ensure proper fixation of the diode chip without displacement or climbing, incorporating filler particles or wavelength converting substances for light adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional light-emitting diode display uses red, green, and blue light-emitting diode chips as pixels arranged to form a full-color display, then the display can achieve full-color capability, but it faces problems such as uneven illumination, electrical controlling difficulties, inability to reduce size, and high manufacturing cost
Solution Approach 1:
The patent merges multiple light-emitting diode chips onto a single substrate, integrating red, green, and blue chips in close proximity. This consolidation approach reduces the overall structure size and simplifies the manufacturing process while maintaining full-color display capability, directly addressing the high manufacturing cost and size limitations of conventional approaches
2Ease of manufacture
If a light transmissive adhesive layer with uniform thickness is used to fix the light-emitting diode chip, then the manufacturing process is simple, but the light-emitting diode chip may displace or the adhesive may climb during heating, reducing manufacturing precision
Solution Approach 1:
The patent applies local quality by creating a light transmissive adhesive layer with non-uniform thickness, where the central portion has a first thickness and the peripheral portion has a second thickness greater than the first. This localized thickness variation prevents adhesive climbing and chip displacement during heating while maintaining manufacturing simplicity, effectively resolving the contradiction between ease of manufacture and manufacturing precision
3Reliability
If the light transmissive adhesive layer has a peripheral portion with greater thickness surrounding a central portion, then chip fixation stability is improved and adhesive climbing is prevented, but the structural complexity increases
Solution Approach 1:
The patent changes the physical parameter of the adhesive layer thickness to resolve the contradiction. By controlling the thickness parameter to be non-uniform (first thickness in center, second thickness at periphery), the patent achieves reliable chip fixation and prevents adhesive climbing without requiring complex multi-layer structures or additional components, thus maintaining structural simplicity while improving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the yield of light-emitting package structures by ensuring stable fixation of light-emitting diode chips, maintaining optical quality, and potentially reducing manufacturing costs while addressing issues of uneven illumination and size constraints.
Implementation Method 1
heating the light transmissive adhesive material, in which a maximum of a rheological loss factor (tan δ)max of the light transmissive adhesive material is in a range from 0.5 to 2.5
Implementation Method 2
a maximum of a rheological loss factor (tan δ)max of the light transmissive adhesive material is in a range from 0.5 to 2.5
Implementation Method 3
the wavelength converting substance absorbs portions of the blue light
Implementation Method 4
converts to corresponding color light
Implementation Method 5
the filler particles are configured to adjust a path of light emitted by the light-emitting diode chip
Data Source
AI summary
A light-emitting package structure includes a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip. The light transmissive adhesive layer includes a first surface and a second surface facing away from the first surface. The substrate is on the first surface of the light transmissive adhesive layer. The light-emitting diode chip is on the second surface of the light transmissive adhesive layer. The light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.