LED Package Reflective Resin Layout for Adhesive Light Loss
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Solution Overview
Problem
Existing light emitting device packages face challenges in maximizing light extraction efficiency and maintaining color distribution due to the presence of adhesive layers, which can lead to a decrease in luminous flux.
Innovation Solution
A light emitting device package design that includes a package substrate with a semiconductor light emitting device, a wavelength conversion portion, and a reflective resin portion with a protrusion extending between the wavelength conversion portion and the substrate structure, where the adhesive layer is strategically positioned to minimize contact with the reflective resin, thereby preventing luminous flux loss and enhancing light extraction efficiency and color distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an adhesive layer is used to attach the wavelength conversion portion to the semiconductor light emitting device, then the wavelength conversion portion can be securely mounted, but the adhesive layer causes luminous flux loss and reduces light extraction efficiency
Solution Approach 1:
The patent extracts the adhesive layer from the light extraction path by positioning it only on the side surfaces of the semiconductor light emitting device, not on the upper surface where light is emitted. This allows the wavelength conversion portion to be mounted securely while minimizing its interference with light extraction, thus resolving the contradiction between mounting reliability and luminous flux loss.
Solution Approach 2:
The adhesive layer is applied selectively to different locations: on the side surfaces for secure mounting, but avoided on the upper surface to prevent luminous flux loss. This localized application strategy allows the system to achieve reliable mounting while maintaining high light extraction efficiency in the critical light emission area.
2Productivity
If the wavelength conversion portion covers the entire light emitting device, then complete wavelength conversion is achieved, but light extraction efficiency decreases due to increased adhesive layer interference
Solution Approach 1:
The wavelength conversion portion is segmented into different regions: a first region that contacts the semiconductor light emitting device through the adhesive layer for secure mounting, and a second region that extends outward without adhesive interference to maintain high light extraction efficiency. This segmentation allows complete wavelength conversion while minimizing luminous flux loss.
Solution Approach 2:
The wavelength conversion portion extends in multiple dimensions: it covers the upper surface for wavelength conversion and extends outwardly in a radial direction to form a flared shape. This dimensional extension allows the second region to protrude beyond the light emitting device, reducing adhesive layer interference while maintaining complete wavelength conversion coverage.
3Loss of energy
If the wavelength conversion portion has a flared shape extending outwardly, then light extraction efficiency is improved, but the structural complexity increases
Solution Approach 1:
The wavelength conversion portion is designed with a flared, curved shape that extends outwardly from the semiconductor light emitting device in a radial direction. This curved, spheroidal geometry naturally guides and extracts light more effectively while maintaining a relatively simple monolithic structure, thus improving light extraction efficiency without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents luminous flux decrease and improves light extraction efficiency and color distribution by ensuring the reflective resin portion can reflect light emitted from the active layer, while maintaining the adhesive layer's functionality in attaching the wavelength conversion portion.
Implementation Method 1
a reflective resin portion disposed on the package substrate to surround the semiconductor light emitting device and the wavelength conversion portion
Implementation Method 2
a wavelength conversion portion disposed on the semiconductor light emitting device
Data Source
AI summary
A light emitting device package includes a package substrate, a semiconductor light emitting device on the package substrate, the semiconductor light emitting device including a substrate with a light emitting structure, a wavelength conversion portion on the semiconductor light emitting device, the wavelength conversion portion including a first region overlapping the light emitting structure, and a second region other than the first region, an adhesive layer between the semiconductor light emitting device and the wavelength conversion portion, and a reflective resin portion on the package substrate, the reflective resin portion surrounding the semiconductor light emitting device and the wavelength conversion portion, and the reflective resin portion extending to the second region.