Light-emitting Device Package with Air Layer for Enhanced Extraction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light-emitting device packages face challenges in achieving high light extraction efficiency and reliability due to light absorption by underlying structures and heat-related deterioration.
Innovation Solution
A light-emitting device package design featuring a supporting substrate with a groove, a light-emitting device partially inserted into the groove, an adhesive layer on the side surface, and an air layer between the substrate and the device, which enhances light reflection and heat dissipation by minimizing contact between the reflective structure and adhesive layer, thereby improving light extraction efficiency and reducing heat-induced deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light-emitting device is directly mounted on the supporting substrate, then the device structure is simple and easy to manufacture, but light extraction efficiency is reduced due to light absorption by the substrate and adhesive layer
Solution Approach 1:
The patent extracts the light-emitting device from direct contact with the supporting substrate by introducing an air layer between them. The device is mounted on a raised portion or protrusion of the substrate, creating a gap that eliminates light absorption by the substrate and adhesive layer, thereby improving light extraction efficiency while maintaining manufacturing simplicity
Solution Approach 2:
The patent introduces an air layer as an intermediary between the light-emitting device and the supporting substrate. This air layer acts as a mediator that prevents direct optical interaction between the device and substrate, reducing light absorption and improving extraction efficiency without complicating the manufacturing process
2Strength
If the adhesive layer covers the entire lower surface of the light-emitting device, then the bonding strength is high, but heat dissipation is reduced and reliability deteriorates
Solution Approach 1:
The patent segments the adhesive layer application area, applying adhesive only to the side surface or specific portions of the light-emitting device rather than the entire lower surface. This segmentation maintains sufficient bonding strength while creating air gaps that improve heat dissipation and reduce thermal deterioration
Solution Approach 2:
The patent applies adhesive locally to specific areas (side surface or selected portions) rather than uniformly across the entire lower surface. This local quality approach ensures bonding strength where needed while allowing heat dissipation through air layers in other areas, improving overall reliability
3Reliability
If the encapsulation member is formed over the entire area, then the sealing performance is high, but light extraction efficiency is reduced due to encapsulation material absorption
Solution Approach 1:
The patent segments the encapsulation member formation by leaving the air layer area uncovered or partially covered. This segmentation maintains sealing performance in critical areas while allowing light to escape efficiently from the air layer region, improving overall light extraction efficiency
Solution Approach 2:
The patent applies encapsulation material locally to specific areas rather than uniformly across the entire device. This local quality approach ensures sealing where needed while creating light extraction pathways in other areas, resolving the contradiction between sealing performance and light extraction efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly enhances light extraction efficiency by increasing total reflection and reduces heat-related reliability issues, leading to improved performance and longevity of the light-emitting device package.
Implementation Method 1
an air layer between the supporting substrate and the light-emitting device
Implementation Method 2
enhances light reflection by minimizing contact between the reflective structure and adhesive layer
Implementation Method 3
an air layer between the supporting substrate and the light-emitting device
Data Source
AI summary
A light-emitting device package includes a supporting substrate, a light-emitting device on the supporting substrate, an adhesive layer on at least a portion of a side surface or lower surface of the light-emitting device, the adhesive layer connecting the light-emitting device to the supporting substrate, and an air layer in a space defined by the supporting substrate, the light-emitting device, and the adhesive layer.