Light Emitting Device Package with Air-Filled Mounting Part
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Solution Overview
Problem
Conventional light emitting device packages using molding resin suffer from color deviation due to phosphor distribution variations during heat curing, leading to increased production time and reduced luminous efficiency, as well as unwanted light absorption and emission phenomena.
Innovation Solution
A light emitting device package design featuring first and second electrodes with a reflection wall and a fluorescent film that surrounds the light emitting device, where the fluorescent film is bonded to the reflection wall and includes phosphors, eliminating the need for molding resin and ensuring uniform phosphor distribution, thereby reducing color deviation and improving luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If molding resin with phosphors is used to fill the space between LED element and package main body, then the LED package can be manufactured using conventional processes, but phosphor distribution becomes non-uniform due to heat curing causing color deviation and increased production time
Solution Approach 1:
The patent extracts phosphors from the molding resin and places them directly on the LED chip surface, eliminating the heat curing process that causes non-uniform phosphor distribution. This allows the molding resin to serve only its structural encapsulation function while phosphors are applied separately for uniform color conversion.
Solution Approach 2:
The patent segments the manufacturing process into distinct steps: first forming the molding resin structure, then separately applying phosphors to the LED chip. This segmentation allows each material to be optimized for its specific function without the compromises required when combined in a single molding resin mixture.
2Reliability
If molding resin is injected into each light emitting device package, then complete package sealing can be achieved, but production time increases due to the additional injection process
Solution Approach 1:
The patent performs preliminary actions by pre-forming the molding resin structure and pre-applying phosphors to the LED chip before final assembly. This eliminates the need for time-consuming injection molding of phosphor-containing resin for each individual package, thereby reducing production time while maintaining sealing integrity.
3Ease of manufacture
If phosphors are distributed in molding resin, then color conversion can be achieved, but light absorption and emission phenomena cause unwanted wavelengths to be generated and emitted
Solution Approach 1:
The patent applies local quality by placing phosphors only where needed - directly on the LED chip surface where blue light is emitted - rather than distributing them throughout the entire molding resin volume. This localized application optimizes color conversion efficiency and reduces unwanted light absorption and re-emission phenomena.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances color uniformity, reduces production complexity, and improves light extraction efficiency by minimizing unintended light interactions, resulting in a high-quality light emitting device package with improved color deviation characteristics and luminous efficiency.
Implementation Method 1
The fluorescent film may convert light emitted from the light emitting device such that the light has at least one wavelength among yellow, red, and green
Implementation Method 2
a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device
Data Source
Figure 1~3
Figure 4~6A
Figure 6B~6E
AI summary
A light emitting device package includes: first (11,21,31,41,51,61) and second (12,22,32,42,52,62) electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device (13,23,43,53,63) disposed on an upper surface of at least one of the first and second electrodes; a reflection wall (15,25,35,45,55,65) disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film (16,26,36,46,56,66) disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.