LED Package Array Testing on Lead Frame
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Solution Overview
Problem
The existing manufacturing processes for LED packages are inefficient in testing the operational state of multiple packages simultaneously, leading to low testing efficiency and reliability due to potential defective contacts that become apparent only at high temperatures.
Innovation Solution
An apparatus and method that involves heating an array of LED packages on a lead frame to high temperatures, applying a voltage or current using a multi-probe pin array, and using a camera to test for open, short, or lit conditions, allowing for simultaneous testing and subsequent separation of functional and defective packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If LED packages are tested individually after separation, then testing accuracy is improved, but testing time and productivity are significantly reduced
Solution Approach 1:
Multiple LED packages are arranged in an array on a single lead frame and tested simultaneously as a group rather than individually. The test probe contacts multiple packages at once, allowing parallel testing that maintains accuracy while dramatically increasing productivity.
Solution Approach 2:
The lead frame is divided into multiple mounting areas, each containing LED packages that can be tested in groups. This segmentation allows systematic arrangement and testing of multiple packages while maintaining the ability to identify individual package results.
2Speed
If testing is performed at room temperature, then testing speed is improved, but defective contacts are not detected
Solution Approach 1:
The testing temperature parameter is changed from room temperature to elevated temperature (e.g., 85°C or higher). This parameter change causes latent defects in wire bonds and contacts to manifest, enabling detection of defects that would not be apparent at lower temperatures while maintaining testing efficiency.
3Ease of operation
If all LED packages are cut and separated for testing, then individual package testing is enabled, but time consumption increases
Solution Approach 1:
LED packages are arranged in an array on the lead frame before testing, with test probes positioned to contact multiple packages simultaneously. This preliminary arrangement enables group testing without requiring complete separation of packages, reducing time loss while maintaining individual package test capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the testing efficiency and reliability of LED packages by identifying latent defects at high temperatures, improving the classification of products and reducing the time required for testing, thereby increasing the overall efficiency of the manufacturing process.
Implementation Method 1
a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame
Implementation Method 2
a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit
Implementation Method 3
using a camera to test for open, short, or lit conditions
Data Source
AI summary
An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.