Integrated LED Package with Bent Leads for Side-View Emission
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Solution Overview
Problem
Conventional LED package structures are limited by the need for an external driver chip, restricting their design and functionality.
Innovation Solution
An LED package structure that integrates a driver chip within the package, using an LED frame, driver frame unit, housing, and light-permeable package body, allowing the driver chip to drive the LED chips and enabling light emission in both side-view and front-view directions through bent leads protruding from the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an external driver chip is used to control LED chips, then the LED package structure is simpler, but the design flexibility and functionality are limited
Solution Approach 1:
The patent merges the driver chip and LED chips into a single integrated package structure. The driver chip is mounted on the same substrate as the LED chips, with wiring patterns that directly connect the driver chip pads to LED chip pads, eliminating the need for external driver chips and enabling enhanced design flexibility and functionality.
2Adaptability or versatility
If bent leads protrude from lateral surfaces of the housing, then light emission directions are enhanced, but the housing structure becomes more complex
Solution Approach 1:
The patent extends the functionality of bent leads by having them protrude not only from the bottom surface but also from lateral surfaces of the housing. This dimensional expansion allows electrical connections and light emission from multiple directions (front-view and side-view), enhancing the LED package's adaptability for various mounting and lighting applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration allows for independent operation of the LED package without an external driver chip, enhancing design flexibility and user-directed light emission capabilities.
Implementation Method 1
a light-permeable package body filled in the cavity. The LED chips and the driver chip are embedded in the light-permeable package body
Data Source
AI summary
An LED package structure includes an LED frame, a driver frame unit, a housing, LED chips, a driver chip, and a light-permeable package body. The LED frame includes a carrying segment and two bent leads connected to the carrying segment. The driver frame unit includes two side frames each having a functional segment and a bent lead. The housing has a cavity exposing the carrying segment and the two functional segments. The bent leads protrude from a lateral surface of the housing, and curvedly extend to a bottom surface of the housing. The LED chips are mounted on the carrying segment. The driver chip is fixed to one of the two functional segments, and is electrically connected to the other functional segment and the LED chips. The light-permeable package body is filled in the cavity so as to embed the LED chips and the driver chip.