Light Emitting Device Package Bonding Pad Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor device packages face challenges in improving light extraction efficiency, electrical properties, and manufacturing costs, while also experiencing re-melting phenomena during re-bonding processes, which affect the reliability and stability of the bonding region.
Innovation Solution
The design incorporates a bonding pad structure with contact and non-contact regions on a through hole, utilizing intermetallic compound layers with specific compositions and layer configurations to enhance bonding strength and prevent re-melting, allowing for stable bonding at low temperatures and improved manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding structures are used, then manufacturing is simpler, but re-melting phenomena occur during re-bonding processes affecting reliability
Solution Approach 1:
The bonding pad is segmented into contact regions and non-contact regions, allowing the contact regions to provide stable electrical connection while non-contact regions prevent re-melting during re-bonding processes. This segmentation resolves the contradiction by dividing the bonding pad functionality into distinct zones that address both reliability and process stability concerns.
Solution Approach 2:
Different regions of the bonding pad are given different properties: contact regions have properties optimized for electrical connection and bonding strength, while non-contact regions have properties that prevent re-melting. This local differentiation allows the structure to simultaneously achieve high reliability and prevent defects during manufacturing.
2Illumination intensity
If light extraction efficiency is improved through structural modifications, then optical performance increases, but manufacturing complexity increases
Solution Approach 1:
The bonding pad structure serves multiple functions simultaneously: it provides electrical connection, mechanical bonding, and light extraction enhancement. By integrating these functions into a single structure with contact and non-contact regions, the design improves light extraction efficiency without proportionally increasing manufacturing complexity.
3Strength
If bonding strength is enhanced through intermetallic compound layers, then electrical properties improve, but manufacturing precision requirements increase
Solution Approach 1:
Intermetallic compound layers are formed in advance during the bonding process, creating strong electrical connections before final package assembly. This preliminary formation of bonding layers ensures strong electrical properties while allowing subsequent manufacturing steps to focus on assembly rather than precise layer formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances light extraction efficiency, electrical properties, and manufacturing yield, while preventing re-melting phenomena, thereby improving the reliability and stability of the semiconductor device package.
Implementation Method 1
utilizing intermetallic compound layers with specific compositions and layer configurations to enhance bonding strength
Implementation Method 2
preventing re-melting phenomena during re-bonding processes, which affect the reliability and stability of the bonding region
Data Source
AI summary
The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.