Multi-Material LED Package Structure for Light Extraction and Bonding
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Solution Overview
Problem
Current semiconductor device packages face challenges in improving light extraction efficiency, electrical characteristics, and manufacturing costs, while also experiencing issues with re-melting during thermal treatments and bonding processes.
Innovation Solution
A semiconductor device package design featuring a first and second package body with different materials, including reflective and wavelength conversion materials, and a recess structure to enhance light extraction and bonding reliability, along with a method of manufacturing that eliminates the need for lead frames and reduces process complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional semiconductor device packages are used, then manufacturing process is simpler, but light extraction efficiency is poor
Solution Approach 1:
The package body is divided into multiple sections including a recess portion and protrusion portions, creating distinct functional zones that optimize light extraction while maintaining manufacturing feasibility through modular structure design
Solution Approach 2:
Different regions of the package body are given different properties: the recess portion provides enhanced light extraction through its geometric structure, while protrusion portions provide bonding surfaces, creating local functional optimization without complicating the overall manufacturing process
2Reliability
If package body materials are optimized for light extraction, then light extraction efficiency improves, but re-melting occurs during thermal treatment
Solution Approach 1:
The package body employs composite material construction combining resin base material with inorganic particles, creating a multi-phase composite that simultaneously achieves high light extraction efficiency through refractive index differences and thermal stability through the heat-resistant inorganic component structure
3Reliability
If bonding strength is increased through material selection, then bonding reliability improves, but manufacturing cost increases
Solution Approach 1:
The bonding surface properties are optimized by controlling the chemical composition and surface morphology of the protrusion portions, achieving enhanced bonding strength through parameter optimization of existing materials rather than introducing expensive specialized bonding materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light extraction efficiency, electrical characteristics, and manufacturing yield, while preventing re-melting and discoloration issues, thus enhancing the reliability and cost-effectiveness of the semiconductor device package.
Implementation Method 1
the first package body and the second package body may comprise different materials selected from PPA, PCT, EMC, SMC, and PI, and the first package body may comprise a reflective material, and the second package body may comprise at least one of a wavelength conversion material and a reflective material
Implementation Method 2
the first package body may comprise a reflective material, and the second package body may comprise at least one of a wavelength conversion material and a reflective material
Data Source
AI summary
A light emitting device package including a package body comprising a first opening; a light emitting device disposed in the first opening and including a first bonding part and a second bonding part; a first conductor disposed below the first bonding part; and a second conductor disposed below the second bonding part. Further, the first conductor is electrically connected to the first bonding part, and the second conductor is electrically connected to the second bonding part.